Presentation Information
[PS-03-08]Mechanical Characterization of Sintered Silver Films with Copper Particles for SiC Die Attach Applications
〇Chessadakorn - Chantawong1, Michiko Shindo1, Mitsuhiro Nishida2, Takahiro Namazu1 (1. Kyoto University of Advanced Science, Kyoto, Japan (Japan), 2. Nihon Superior Co., Ltd., Osaka, Japan (Japan))