2024 International Conference on Solid State Devices and Materials
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Session Details

Poster Session03: Heterogeneous and 3D Integration / Interconnect / MEMS

[PS-03]03: Heterogeneous and 3D Integration / Interconnect / MEMS

Tue. Sep 3, 2024 3:00 PM - 5:00 PM JST
Tue. Sep 3, 2024 6:00 AM - 8:00 AM UTC
Poster Hall (Exhibition Hall A)(1st Floor)

[PS-03-01]Investigation of Propagation Directions on GaN Surface Acoustic Wave Resonators Toward Wide Temperature Range Applications

〇Guofang Yu1, Renrong Liang1, Jun Fu1, Jun Xu1, Tian-Ling Ren1, Jingqing Du2, Di Zhao2 (1. Tsinghua Univ. (China), 2. Beijing Sevenstar Flow Corp., Ltd. (China))

[PS-03-02]Improvement of Uniformity by Face-to-Face Ultra-High-Pressure Annealing Observed by Scanning Internal Photoemission Microscopy Using Au/Ni/n-GaN Schottky Contacts

〇Kenji Shiojima1, Yasuho Matsumoto1, Hiroki Imabayashi1, Tetsu Kachi2 (1. Univ. of Fukui (Japan), 2. Nagoya Univ. (Japan))

[PS-03-03]Size effect on mechanical characteristics of 3D-printed resin nanowires

〇Masao Torii1 (1. Kyoto University of Advanced Science in Nanomechatronics Lab. (Japan))

[PS-03-04]Consideration on the electrochemical behavior of graphene dispersed in aqueous solution

〇Naoki Okamoto1, Rei Miyake1, Takeyasu Saito1 (1. Osaka Metropolitan Univ. (Japan))

[PS-03-05]Control of Surface Oxidation and Stress by Additives in Ni Electrodeposition

〇Takeyasu Saito1, Kohei Yamada1, Ryosuke Komoda1, Naoki Okamoto1 (1. Osaka Metropolitan University (Japan))

[PS-03-06]Precise Measurements of Small Reverse-Biased-Currents for Large-Barrier Au/Ni/n-GaN Schottky Contacts

〇Kenji Shiojima1, Hiroki Imabayashi1, Kentaro Kawanishi1, Hiroshi Ohta2, Tomoyoshi Mishima2 (1. Univ. of Fukui (Japan), 2. Hosei Univ. (Japan))

[PS-03-07]Low-temperature deposited thin ZrN films for backside Cu interconnect

〇Masaru Sato1, Mayumi B. Takeyama1 (1. Kitami Inst. of Tech. (Japan))

[PS-03-08]Mechanical Characterization of Sintered Silver Films with Copper Particles for SiC Die Attach Applications

〇Chessadakorn - Chantawong1, Michiko Shindo1, Mitsuhiro Nishida2, Takahiro Namazu1 (1. Kyoto University of Advanced Science, Kyoto, Japan (Japan), 2. Nihon Superior Co., Ltd., Osaka, Japan (Japan))
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