[SO-PS-03] 03: Heterogeneous and 3D Integration / Interconnect / MEMS

1:42 PM - 1:44 PM JST(4:42 AM - 4:44 AM UTC)

[SO-PS-03-07] Low-temperature deposited thin ZrN films for backside Cu interconnect

〇Masaru Sato¹, Mayumi B. Takeyama¹ (1. Kitami Inst. of Tech. (Japan))

DOI:

https://doi.org/10.7567/SSDM.2024.PS-03-07

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