2024 International Conference on Solid State Devices and Materials
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Session Details

Short Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[SO-PS-03]03: Heterogeneous and 3D Integration / Interconnect / MEMS

Tue. Sep 3, 2024 1:30 PM - 1:46 PM JST
Tue. Sep 3, 2024 4:30 AM - 4:46 AM UTC
Room C (409)(4th Floor)
Session Chair: Mayumi Takeyama (Kitami Inst. of Technology), Takeyasu Saito (Osaka Metropolitan Univ.)
1:30 PM - 1:32 PM JST(4:30 AM - 4:32 AM UTC)

[SO-PS-03-01]Investigation of Propagation Directions on GaN Surface Acoustic Wave Resonators Toward Wide Temperature Range Applications

〇Guofang Yu1, Renrong Liang1, Jun Fu1, Jun Xu1, Tian-Ling Ren1, Jingqing Du2, Di Zhao2 (1. Tsinghua Univ. (China), 2. Beijing Sevenstar Flow Corp., Ltd. (China))
1:32 PM - 1:34 PM JST(4:32 AM - 4:34 AM UTC)

[SO-PS-03-02]Improvement of Uniformity by Face-to-Face Ultra-High-Pressure Annealing Observed by Scanning Internal Photoemission Microscopy Using Au/Ni/n-GaN Schottky Contacts

〇Kenji Shiojima1, Yasuho Matsumoto1, Hiroki Imabayashi1, Tetsu Kachi2 (1. Univ. of Fukui (Japan), 2. Nagoya Univ. (Japan))
1:34 PM - 1:36 PM JST(4:34 AM - 4:36 AM UTC)

[SO-PS-03-03]Size effect on mechanical characteristics of 3D-printed resin nanowires

〇Masao Torii1 (1. Kyoto University of Advanced Science in Nanomechatronics Lab. (Japan))
1:36 PM - 1:38 PM JST(4:36 AM - 4:38 AM UTC)

[SO-PS-03-04]Consideration on the electrochemical behavior of graphene dispersed in aqueous solution

〇Naoki Okamoto1, Rei Miyake1, Takeyasu Saito1 (1. Osaka Metropolitan Univ. (Japan))
1:38 PM - 1:40 PM JST(4:38 AM - 4:40 AM UTC)

[SO-PS-03-05]Control of Surface Oxidation and Stress by Additives in Ni Electrodeposition

〇Takeyasu Saito1, Kohei Yamada1, Ryosuke Komoda1, Naoki Okamoto1 (1. Osaka Metropolitan University (Japan))
1:40 PM - 1:42 PM JST(4:40 AM - 4:42 AM UTC)

[SO-PS-03-06]Precise Measurements of Small Reverse-Biased-Currents for Large-Barrier Au/Ni/n-GaN Schottky Contacts

〇Kenji Shiojima1, Hiroki Imabayashi1, Kentaro Kawanishi1, Hiroshi Ohta2, Tomoyoshi Mishima2 (1. Univ. of Fukui (Japan), 2. Hosei Univ. (Japan))
1:42 PM - 1:44 PM JST(4:42 AM - 4:44 AM UTC)

[SO-PS-03-07]Low-temperature deposited thin ZrN films for backside Cu interconnect

〇Masaru Sato1, Mayumi B. Takeyama1 (1. Kitami Inst. of Tech. (Japan))
1:44 PM - 1:46 PM JST(4:44 AM - 4:46 AM UTC)

[SO-PS-03-08]Mechanical Characterization of Sintered Silver Films with Copper Particles for SiC Die Attach Applications

〇Chessadakorn - Chantawong1, Michiko Shindo1, Mitsuhiro Nishida2, Takahiro Namazu1 (1. Kyoto University of Advanced Science, Kyoto, Japan (Japan), 2. Nihon Superior Co., Ltd., Osaka, Japan (Japan))
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