[SO-PS-03] 03: Heterogeneous and 3D Integration / Interconnect / MEMS

1:44 PM - 1:46 PM JST(4:44 AM - 4:46 AM UTC)

[SO-PS-03-08] Mechanical Characterization of Sintered Silver Films with Copper Particles for SiC Die Attach Applications

〇Chessadakorn - Chantawong¹, Michiko Shindo¹, Mitsuhiro Nishida², Takahiro Namazu¹ (1. Kyoto University of Advanced Science, Kyoto, Japan (Japan), 2. Nihon Superior Co., Ltd., Osaka, Japan (Japan))

DOI:

https://doi.org/10.7567/SSDM.2024.PS-03-08

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