2024 International Conference on Solid State Devices and Materials
Advanced Search

Session Details

Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[C-2]MEMS and Advanced Metallization I

Mon. Sep 2, 2024 4:15 PM - 4:45 PM JST
Mon. Sep 2, 2024 7:15 AM - 7:45 AM UTC
Room C (409)(4th Floor)
Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Christian Dussarrat (Air Liquide)
4:15 PM - 4:45 PM JST(7:15 AM - 7:45 AM UTC)Invited

[C-2-01 (Invited)]Evaluation Platforms for Next-Generation Semiconductor Packaging Technologies

〇Hirokazu Noma1 (1. Resonac Corp. (Japan))
Back to Category List