Presentation Information

[E-4-02]Characterization and Modeling of 16nm FinFET 3D Stackable Via RRAM

〇Wei-Hwa Lin1, Tsung-Pei Yang1, Kai-Ching Chuang1, Howard Tseng2, Tassa Yang2, Sung-Po Liao2, Tim Chung2, Ya-Chin King1, Chrong Jung Lin1 (1. Inst. of Electronics Engineering, National Tsing Hua Univ. (Taiwan), 2. Memory and Product Diagnosis Engineering Division(MDED), Taiwan Semiconductor Manufac. Company (Taiwan))

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