Presentation Information
[F-3-03]A 78% Area-Reduction in Edge-Coupled Inductive Coupling Link for Flexible Chip Assembly Using Oblong Coil
〇Yuki Mitarai1, Masaya Kawano1, Hung-Chih Huang1, Tadahiro Kuroda1, Mototsugu Hamada1, Atsutake Kosuge1 (1. The University of Tokyo (Japan))