[J-3] 3D Integration/Novel Materials

10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)

[J-3-02 (Late News)] Evaluation of Lateral and Depth Distribution of Si Strain around Cu Through Silicon Via by Micro-Raman Spectroscopy

〇Ryota Fujimori¹, Yuta Ito¹, Atsushi Ogura^1,2, Koichiro Saga³ (1. Meiji University (Japan), 2. Meiji Renewable Energy Laboratory (Japan), 3. Sony Semiconductor Solutions Corporation (Japan))