2025 International Conference on Solid State Devices and Materials
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Session Details

Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[J-3]3D Integration/Novel Materials

Wed. Sep 17, 2025 9:45 AM - 10:15 AM JST
Wed. Sep 17, 2025 12:45 AM - 1:15 AM UTC
Room J (411+412, 4th Floor)
Session Chair: Takeo Minari (NIMS), Masayuki Kitamura (KIOXIA Corp.)
9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[J-3-01]Neuromorphic Electronics Enabled by Photoresponsive Dielectric Materials and Transistor Architectures

〇Cancan Cui1, Hongwei Ge1, Yu Yan1, Mengwei Wang1, Meina Xiao1, Xiaoyu Zhang1, Qingqing Sun1, Xuying Liu1 (1. The Univ. of Zhengzhou (China))
10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)

[J-3-02 (Late News)]Evaluation of Lateral and Depth Distribution of Si Strain around Cu Through Silicon Via by Micro-Raman Spectroscopy

〇Ryota Fujimori1, Yuta Ito1, Atsushi Ogura1,2, Koichiro Saga3 (1. Meiji University (Japan), 2. Meiji Renewable Energy Laboratory (Japan), 3. Sony Semiconductor Solutions Corporation (Japan))
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