講演情報
[7p-N105-2]Thermal conductivity measurement of unprocessed microparticles for TIMs
〇(PC)Pauline Pradal1, Ito Soutaro1, Kim Byunggi2, Masahiro Nomura1 (1.Inst. of Industrial Science, Depart. of Informatics and Electronics, The University of Tokyo, 2.Inst. of Science Tokyo)
キーワード：
Thermal Interfacial Materials、Thermal Conductivity、Alumina microparticles
As modern electronic devices continue to shrink in size while increasing in power density, efficient thermal management has become a critical challenge. To address this issue, thermal interface materials (TIMs) are commonly employed to enhance heat transfer between the devices and heat sinks. Due to their ease of processing, most commercial TIMs are polymer composites composed of thermally conductive particles such as alumina. To optimize TIM performance, it is important to accurately determine the thermal conductivity of these fillers, which often exhibits lower values than that of their bulk crystalline counterparts due to structural heterogeneities. However, direct measurement of the thermal conductivity of individual microparticles remains challenging. In addition, sample preparation procedures frequently involve processing steps that may alter the intrinsic thermal properties of the fillers.
In this work, we present a straightforward sample preparation protocol that enables the characterization of the thermal properties of unprocessed fillers. Using time-domain thermoreflectance (TDTR), as illustrated in Figure 1a, in combination with 3D FEM simulations, we determine the thermal conductivity of individual Alumina microparticles with diameters ranging from 100 μm down to 4 μm, as shown in Figure 1b–c. We expect this approach to provide a reliable approach to characterize newly synthesized fillers and to support the development of next-generation TIMs for advanced thermal management applications.
In this work, we present a straightforward sample preparation protocol that enables the characterization of the thermal properties of unprocessed fillers. Using time-domain thermoreflectance (TDTR), as illustrated in Figure 1a, in combination with 3D FEM simulations, we determine the thermal conductivity of individual Alumina microparticles with diameters ranging from 100 μm down to 4 μm, as shown in Figure 1b–c. We expect this approach to provide a reliable approach to characterize newly synthesized fillers and to support the development of next-generation TIMs for advanced thermal management applications.