Session Details
[18p-C42-1~7]2D materials and their integrated circuit and electronic device applications
Wed. Sep 18, 2024 1:30 PM - 5:15 PM JST
Wed. Sep 18, 2024 4:30 AM - 8:15 AM UTC
Wed. Sep 18, 2024 4:30 AM - 8:15 AM UTC
C42 (Hotel Nikko 4F)
Yukiko Takamura(JAIST), Akinobu Teramoto(Hiroshima Univ.)
[18p-C42-1]2D Material and Device Technologies for 3D-Stacked FET
〇Hitoshi Wakabayashi1 (1.IIR, Tokyo Tech)
[18p-C42-2]Toward wafer-scale integrated circuit technology using two-dimensional materials
〇Kosuke Nagashio1 (1.UTokyo)
[18p-C42-3]Possible applications of 2D material devices and related integration challenges
〇Tom Schram1 (1.imec)
[18p-C42-4]TMD Film Deposition using Novel Metal-organic Precursors
〇Atsushi Ogura1,2, Hideaki Machida3 (1.Meiji Univ., 2.Meiji Renewable Energy Laboratory, 3.Gas-phase Growth Ltd.)
[18p-C42-5]Two-dimensional-heterostructures for functional quantum materials
〇Ryo Kitaura1 (1.NIMS)
[18p-C42-6]Fabrication and applications of van der Waals junctions of 2D materials
〇Tomoki Machida1 (1.IIS, Univ. of Tokyo)
[18p-C42-7]Photochromic Molecule in Solution Combined with 2D Material FET for Optical Device
〇Tadahiro Komeda Komeda1, Tsuyoshi Takaoka1 (1.IMRAM, Tohoku Univ.)