Session Details

[19p-A23-1~5]Advancements in Junction Technologies and Cutting-Edge Si-LSIs: Past, Present, and Future

Thu. Sep 19, 2024 1:30 PM - 4:25 PM JST
Thu. Sep 19, 2024 4:30 AM - 7:25 AM UTC
A23 (TOKI MESSE 2F)
Osamu Nakatsuka(Nagoya Univ.), Bunji Mizuno(UJTLab), Ichiro Mizushima(NuFrae Technology, Inc.)

[19p-A23-1]Evolution of CMOS S/D Stressor Technology from Planar to 3-D Stacked Devices

〇John Ogawa Borland1 (1.J.O.B. Technologies)
Comment()

[19p-A23-2]Challenges and Development in Interface Engineering of Metal/Group-IV Semiconductor Contacts for Advanced ULSI Electronics

〇Osamu Nakatsuka1,2, Shigehisa Shibayama1, Mitsuo Sakashita1, Masashi Kurosawa1 (1.Grad. Sch. Eng., Nagoya Univ., 2.IMaSS, Nagoya Univ.)
Comment()

[19p-A23-3]Panel Discussion

〇Bunji Mizuno1, Hiroshi Iwai2, Hitoshi Wakabayashi3, Ichiro Mizushima4, Masayasu Tanjo5, John Ogawa Borland6, Osamu Nakatsuka7,8, Kazuyoshi Takayama9 (1.UJTLab, 2.NYCU, 3.IIR, Tokyo Tech, 4.NuFlare Technology, 5.Retired Nissin Ion, 6.J.O.B. Technologies, 7.Grad. Sch. Eng., Nagoya Univ., 8.IMaSS, Nagoya Univ., 9.kind of happy)
Comment()

[19p-A23-4]What can the Society do to cultivate the semiconductor technology ecosystem? Recommendations for initiatives to 'reduce inter-disciplinary miscommunication

〇Kazuyoshi Takayama1 (1.kind of happy)
Comment()

[19p-A23-5]Closing

〇Kazuo Tsutsui1 (1.IIR, Tokyo Tech)
Comment()