Recent Progress of Novel Sintering Technologies Toward Advanced Materials Development

1:55 PM - 2:10 PM JST(4:55 AM - 5:10 AM UTC)

[3-15A] Low-Temperature Sinter Bonding Using Micro- and Nanoparticles for Electronics Packaging 《 Sintering, Microstructure Control 》

*Hiroaki Tatsumi¹, Seonghwan Park^1,2, Chuncheng Wang^1,2, Hiroshi Nishikawa¹ (1. Joining and Welding Research Institute, The University of Osaka, 2. Graduate School of Engineering, The University of Osaka)

Keywords:

Sinter bonding,Nanoparticles,Electronics packaging