Presentation Information
[3H02]Evaluation of incident particle momentum during sputter-deposition using an in-situ stress observation system
*shigeki nakagawa1, Takuto Sekine1, Daisuke Iida1, Yutaka Nakamitsu2, Tetsuji Kiyota2 (1. Institute of Science Tokyo, 2. ULVAC, Inc.)
The pressure caused by the impinging particles to the growing films durting sputter-deposition was detected for various kind of sputtering conditions to discuss the effect of the impinging particles at the initial stage of the film growth. In-situ observation system can detect the displacement of the sheet glass caused by the impingement of the particles to the substrate. Abrupt changes of the displacement appeared at the start and end points of sputter-deposition indicate the change of pressure P caused by the existence of impingement of particles to the substrate.
At high pressure region of 0.8 Pa, the average momentum of the impinging particles for Kr sputtering seems to be lower than that for Ar sputtering. This lower impingement of momentum to the substrates seems to be one of the origins of the development of tensile stress in the film sputter deposited using Kr at high pressure region. On the contrary, in lower pressure region such as 0.2 Pa, the momentum transfer to the substrate from the energetic particle seems to be lower for Ar sputtering situation lather than that for Kr sputtering situation.
At high pressure region of 0.8 Pa, the average momentum of the impinging particles for Kr sputtering seems to be lower than that for Ar sputtering. This lower impingement of momentum to the substrates seems to be one of the origins of the development of tensile stress in the film sputter deposited using Kr at high pressure region. On the contrary, in lower pressure region such as 0.2 Pa, the momentum transfer to the substrate from the energetic particle seems to be lower for Ar sputtering situation lather than that for Kr sputtering situation.