Session Details
[1B01-05]Sputtering and Plasma Processes
Tue. Sep 15, 2026 2:00 PM - 4:00 PM JST
Tue. Sep 15, 2026 5:00 AM - 7:00 AM UTC
Tue. Sep 15, 2026 5:00 AM - 7:00 AM UTC
B: Multi-purpose room 2 (1F)
Chair:Takeo Nakano, Ryota Shimizu
Recent Advances in Sputtering Processes and Applications
[1B01【依頼講演】]Ultra-low damage deposition of amorphous silicon by facing target sputtering: application to silicon wafer surface passivation
*Shinsuke Miyajima1 (1. Institute of Science Tokyo (Japan))
[1B02【依頼講演】]Multi-pulse magnetron sputtering for diamond-like carbon and vanadium oxide thin films and their time-resolved plasma diagnostics
*Takashi Kimura1 (1. Nagoya Institute of Technology (Japan))
[1B03【招待講演】]Decoupling sputter-deposition parameters using interpretable machine learning: a case study on transparent conducting film
*Naoomi Yamada1, Oga Hayashi1 (1. Department Applied Chemistry, Chubu University (Japan))
[1B04]Enhancement of argon entrapment into hafnium thin films by tantalum addition
*Tomoaki Osumi1, Yasuhito Gotoh1 (1. Kyoto University (Japan))
[1B05]Gas pressure and duty ratio dependences of target erosion profile shape in high-power pulsed magnetron sputtering
*Takeo Nakano1, Ryosuke Matoba1, Keren Lin1 (1. Dept. of Science and Technology, Seikei University (Japan))