Session Details
Forefront of laser processing technology (2) - Industrial applications in semiconductor and transportation equipment manufacturing led by the Chugoku region -
Wed. Jan 22, 2025 3:30 PM - 5:00 PM JST
Wed. Jan 22, 2025 6:30 AM - 8:00 AM UTC
Wed. Jan 22, 2025 6:30 AM - 8:00 AM UTC
Room I(B2F Dahlia(1))
Chair: Daisuke Nakamura
[S01-22p-I-04]レーザを用いた樹脂金属接合と表面処理技術の紹介
*Kiminori Washika1 (1. Hirotec corporation neXt div.)
[S01-22p-I-05]新しいレーザー溶接工法の開発と自動車用シートフレームへの適用
*Masashi Hiraoka1 (1. Delta Kogyo Co.,LTD Production Engineering Dept. No.2)
[S01-22p-I-06]重工業分野におけるレーザ加工の適用事例
*Tomohiro Sugino1 (1. IHI Corporation Technology Platform Center Coporate Research and Development Division Materials & Structural Engineerging Dept.)