Session Details

Forefront of laser processing technology (2) - Industrial applications in semiconductor and transportation equipment manufacturing led by the Chugoku region -

Wed. Jan 22, 2025 3:30 PM - 5:00 PM JST
Wed. Jan 22, 2025 6:30 AM - 8:00 AM UTC
Room I(B2F Dahlia(1))
Chair: Daisuke Nakamura

[S01-22p-I-04]レーザを用いた樹脂金属接合と表面処理技術の紹介

*Kiminori Washika1 (1. Hirotec corporation neXt div.)

[S01-22p-I-05]新しいレーザー溶接工法の開発と自動車用シートフレームへの適用

*Masashi Hiraoka1 (1. Delta Kogyo Co.,LTD Production Engineering Dept. No.2)

[S01-22p-I-06]重工業分野におけるレーザ加工の適用事例

*Tomohiro Sugino1 (1. IHI Corporation Technology Platform Center Coporate Research and Development Division Materials & Structural Engineerging Dept.)