Session Details
[A-4]New device architecture
Wed. Sep 16, 2026 10:30 AM - 12:00 PM JST
Wed. Sep 16, 2026 1:30 AM - 3:00 AM UTC
Wed. Sep 16, 2026 1:30 AM - 3:00 AM UTC
Room A(Convention Hall 1, 2rd Floor)
Session Chair:Anabela Veloso(imec), Pin Su(National Yang Ming Chiao Tung Univ.)
[A-4-01 (Invited)]Value Proposition of Vertical Transistor for Future’s Logic Applications: Symmetry, Drivability and Routability
〇Yanbang Chu1, Yu Liu1, Ziqiao Xu1, Runsheng Wang1, Ming Li1, Heng Wu1 (1. School of Integrated Circuits, Peking University (China))
[A-4-02]Critical PPA Examination of SRAMs with VFET Evolutions: From Frontside to Dual-sided and Stacking
〇Xinyue He1, Siyuan Liu1, Yuji Cheng1, Yu Liu1, Xiangyu Yan1, Runsheng Wang1, Ming Li1, Xing Zhang1, Heng Wu1 (1. School of Integrated Circuits, Peking University (China))
[A-4-03]PPA Examination of Flip Vertical FET (FVFET), a Novel Stacked VFET Architecture
〇Jiahao Zhang1, Ziqiao Xu1, Siyuan Liu1, Yanbang Chu1, Xinyue He1, Yu Liu1, Runsheng Wang1, Ming Li1, Heng Wu1 (1. School of Integrated Circuits, Peking Univ. (China))
[A-4-04]Short-Term Synaptic Plasticity Emulation without Impact Ionization Using a Dual-Gate PN-Body Tied SOI-FET
〇Yukihiko Yamazaki1, Haruki Yonezaki1,2, Jiro Ida1, Takayuki Mori1 (1. Kanazawa Inst. of Tech. (Japan), 2. KIOXIA Corp. (Japan))
[A-4-05]Monolithic 3D All-WSe2 CFET Inverter Enabled by Localized Electron-Beam Band Engineering and 2D-Compatible Process Engineering
〇Chi-Chun Cheng1, Chun-Yen Hsiao1, Long-An Lee1, Nguyen Huynh-Uyen-Phuong1, Po-Wen Chiu1 (1. National Tsing Hua University (Taiwan))
