Session Details
[B-3]DRAM 1
Wed. Sep 16, 2026 8:30 AM - 9:45 AM JST
Wed. Sep 16, 2026 11:30 PM - 12:45 AM UTC
Wed. Sep 16, 2026 11:30 PM - 12:45 AM UTC
Room B(Convention Hall 2, 2rd Floor)
Session Chair:Siva Ramesh(Micron Technology), Hyung-Suk Jung(Samsung Electronics)
[B-3-01]N-Rich Interface-Control Nitride Metal Interlayer for Improved HZO MPB Dielectrics and Reliability in DRAM Capacitors
〇Jaewon Chung1, Sangkuk Han1, Wonjae Choi1, Haesoo Jang1, Sangmyun Lim1, Kyungwook Park1, Sangwoo Jeong1, Soyoung Park1, Kanghyeok Lee1, Changhwan Choi1 (1. Hanyang Univ. (Korea))
[B-3-02]Gas-phase Doping for Enhanced Dual Work Function BCAT in 10-nm node DRAM
Dongkyu Jang1, 〇Taehoon Park1, Inkyum Lee1, Yongmin Jung (1. Samsung Electronics (Korea))
[B-3-03]Low Damaged Bit-line Contact for Excellent Epitaxial Regrowth for Silicon Junction in D1b-nm DRAM
〇Dongkyu Jang1, Taewook Kim1, Seungchul Yang1, Minjoo Oh1, Changmin Kim1, Goeun Heo1, Taehoon Park1 (1. Samsung Electronics (Korea))
[B-3-04]Electrode-Dependent Morphotropic Phase Boundary Characteristics in Hf0.2Zr0.8O2 for Advanced DRAM Capacitors
〇Donguk Lee1, Eunjin Kim1, Jaebin Lee2, Seokjae Lim2, Jiyong Woo1 (1. Kyungpook National Univ. (Korea), 2. Gumi Electronics & Information Tech. Res. Inst. (Korea))
[B-3-05]Fringing-Capacitance Induced Sensing-Margin Loss in Scaled BEOL 2T-DRAM and Its Mitigation
〇Rui-Tong Hu1, Pin Su1 (1. National Yang Ming Chiao Tung Univ. (Taiwan))
