講演情報
[8p-N106-11]Characterization of Cr:LiSAF/Sapphire bonding interface and thermal properties
〇(P)Florent Cassouret1, Yoichi Sato2,1, Takunori Taira2,1 (1.Inst. for Molecular Science, 2.Riken Spring-8 Center)
キーワード：
Direct bonding、Cr:LiSAF、Thermal properties
Successful bonding at room temperature between low thermal conductivity fluoride (Cr:LiSAF) and high thermal conductivity oxide (sapphire) crystals was demonstrated using il-SAB technique. Bonding analysis revealed that Cr:LiSAF is more sensitive to FAB compared to sapphire, resulting in a 40 nm thick amorphous layer, more extended on the Cr:LiSAF side. In addition, accurate measurements of thermal properties of bonded materials showed that the amorphous layer do not induce thermal resistance. As a results, >2.5 times higher effective thermal conductivity was demonstrated for the bonded sample. These results are promising for the power scaling of Cr:LiSAF and fluoride-based laser systems by using bonded chips as gain medium.