[IGS02] International_Cooling of electronic devices

9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[IGS02-02] Subcooled boiling of FC-72 utilizing lotus-type porous copper

〇Kohei Yuki¹, Takuya Ide², Tetsuro Ogushi², Masaaki Murakami², Kazuhisa Yuki¹ (1. Tokyo University of Science-Yamaguchi, 2. Lotus Thermal Solution, Inc.)

Keywords:

Boiling immersion cooling,Subcooled boiling,FC-72,Lotus copper,Surface orientation