[IGS02] International_Cooling of electronic devices

10:30 AM - 10:45 AM JST(1:30 AM - 1:45 AM UTC)

[IGS02-05] Transient thermal impedance network coupled with homogenization model for cooling of power module on electric vehicles

Chen-Yu Chiang¹, Shen-Chi Kuo¹, Min-Kuang Chen¹, 〇Ming-Tsang Lee¹ (1. National Tsing Hua University)

Keywords:

Thermal impedance network,Power module,Electronics cooling,Homogenization model,Pin-fin array