Session Details
[M-1]SiC Mateials and Processes
Tue. Sep 16, 2025 1:30 PM - 3:00 PM JST
Tue. Sep 16, 2025 4:30 AM - 6:00 AM UTC
Tue. Sep 16, 2025 4:30 AM - 6:00 AM UTC
Room M (414+415, 4th Floor)
Session Chair: Tomoya Ono (Kobe Univ.), Kohei Adachi (Mitsubishi Electric)
[M-1-01 (Invited)]Consideration on 4H-SiC surface nitridation reactionsfor designing more efficient SiO2/SiC interface defect passivation processes
〇Koji Kita1 (1. The Univ. of Tokyo (Japan))
[M-1-02]Expansion Rate Change of Single Shockley-Type Stacking Faults in 4H-SiC by High Temperature Annealing After Fluorine or Oxygen Ion Implantation
〇Johji Nishio1, Chiharu Ota1, Ryosuke Iijima1 (1. Toshiba Corp. (Japan))
[M-1-03]Significant Lowering of Interface State Density at Deposited SiO2/SiC Interface by Two-Step O2/N2 Annealing
〇Junhao Meng1, Xianyong Wu1,2, Wei Shan1, Changhong Zhong1, Jingquan Liu1, Xiuyan Li1 (1. Shanghai Jiao Tong Univ. (China), 2. GTA Semiconductor Co., Ltd. (China))
[M-1-04]Study on 4H-SiC (0001) MOS Interface Characteristics with Direct NO Oxynitridation Considering SiC Surface Reaction Kinetics
〇Yutaro Uchida1, Atsushi Tamura1, Koji Kita1 (1. The Univ. of Tokyo (Japan))
[M-1-05]Unveiling Trapped Photoinduced Charges at the 4H-SiC/SiO2 Interface via Graphene Transport
〇Tetsuhiro Owa1, Jin Miura1, Fumiyuki Inamura1, Takashi Ikuta1, Kenzo Maehashi1, Kenji Ikushima1 (1. Tokyo Univ. of A&T (Japan))