[1P534-45] 5. Dispersion and Aggregation

[P5-26] Sintering Process and Electrical Resistivity of Copper Composite Paste: Insights from Rheo-Impedance Measurements

*Reina Ishikawa¹, Yuki Kawata², Hideya Kawasaki³ (1. Graduate School of Science and Engineering, Kansai University (Japan), 2. TA Instruments - Waters LLC (Japan), 3. Faculty of Chemistry, Materials and Bioengineering, Kansai University (Japan))

Keywords:

CuNi paste,Sintering Process,elasticity

Password required to view

Please log in with your Confit account from "or ->Log in".

orLog in