[1P601-13] 6. Solid Surfaces, Wetting, Adsorption and Adhesion

[P6-21] Water-based adhesive powder developed based on dry liquid engineering

*Shota Sugiyama¹, Tomoyasu Hirai^2,3, Yoshinobu Nakamura^2,3, Syuji Fujii^2,3 (1. Graduate School of Engineering, Osaka Institute of Technology (Japan), 2. Faculty of Engineering, Osaka Institute of Technology (Japan), 3. Nanomaterials micro device research center, Osaka Institute of Technology (Japan))

Keywords:

Dry liquid,Water-based adhesive,Solubility parameter,Wetting,Handling

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