Session Details

[GS02-1]Cooling of electronic devices 1

Wed. May 14, 2025 9:30 AM - 10:50 AM JST
Wed. May 14, 2025 12:30 AM - 1:50 AM UTC
Room-A1(Room-A1)
Chair:Noriyuki Unno

[GS02-1-01]人工衛星用電気基板における半導体素子の温度分布平準化

〇Takanori Yamauchi1, Yuta Takemoto1, Hidenobu Tsuji1 (1. Mitsubishi Electric Corporation)

[GS02-1-02]熱回路網法を用いたプリント配線基板内層パターンの放熱性能評価

〇Tomoyuki Hatakeyama1, Risako Kibushi1, Masaru Ishizuka1 (1. Toyama Prefectural University)

[GS02-1-03]マルチドメインシミュレーションに向けたサーマルビアの熱回路網モデル開発

〇Ryuta Yasui1, Natsume Toma1, Yui Matsuda1, Kazunari Hashimoto2, Kazuyoshi Fushinobu1, Takuya Shinoda2 (1. Institute of Science Tokyo, 2. DENSO CORPORATION)

[GS02-1-04]シミュレーションを利用した発熱量推定におけるモデルの高精度化

〇Kouta Sugahara1, Yasushi Kajita2, Masashi Tatematsu2, Fumiaki Takahashi2, Takuya Shinoda3, Yasutaka Aoyama4, Masato Kabetani5 (1. KOZO KEIKAKU ENGINEERING.Inc, 2. Nagoya Municipal Industrial Research Institute, 3. DENSO CORPORATION, 4. AISIN CORPORATION, 5. Toyota Industries Corporation)

Plenary Discussion