[GS02-1] Cooling of electronic devices 1

9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[GS02-1-02] 熱回路網法を用いたプリント配線基板内層パターンの放熱性能評価

〇Tomoyuki Hatakeyama¹, Risako Kibushi¹, Masaru Ishizuka¹ (1. Toyama Prefectural University)

Keywords:

電子機器,プリント配線基板,熱回路網法,内層パターン,サーマルビア

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