Year 2025 Autumn Annual Meeting of JIMM
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Session Details

一般講演6.Materials Processing : Solid process/ Solid and welding process

[G]Solid process/ Solid and welding process(2):Soldering(2)

Fri. Sep 19, 2025 9:00 AM - 12:00 PM JST
Fri. Sep 19, 2025 12:00 AM - 3:00 AM UTC
Room P(N302 3rd floor Building N)
座長:萩沢武仁(日本製鋼)、山田　毅(三菱重工業株式会社)
※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）
9:00 AM - 9:15 AM JST(12:00 AM - 12:15 AM UTC)

[323]Effect of Bonding Conditions on Joint Strength in Transient Liquid Phase Diffusion Bonding with Cu/Sn Plating

*Shunsuke TOTSUKA1, Shohji Ikuo1, Tatsuya Kobayashi1 (1. Graduate School of Science and Technology, Gunma Univ.)
Comment()
9:15 AM - 9:30 AM JST(12:15 AM - 12:30 AM UTC)

[324]Degradation Inhibiting Effect of Electrolytic Ni Plated Electrode on Electromigration of Sn-3.0Ag-0.5Cu Lead-free Solder Joint

*Kenta Kawaguchi1, Tatsuya Kobayashi1, Ikuo Shohji1, Keishi Nakamura2, Koichi Hirasawa2, Hitoshi Amemiya2 (1. Graduate School of Science and Technology, Gunma Univ., 2. KOA CORPORATION)
Comment()
9:30 AM - 9:45 AM JST(12:30 AM - 12:45 AM UTC)

[325]Fatigue Crack Network Formation in Sintered Ag Particles under Equibiaxial Thermal Stress

*Rion ISHII1, Yoshiharu KARIYA2, Koji SASAKI3 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)
Comment()
9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[326]Increase of Plastic Strain in Workpiece by Two-Stage Stretch Forming

*Takeshi Yamada1, Akira Kono1, Taiga Okai1, Kunihiko Abe1 (1. Mitsubishi Heavy Industries, Ltd.)
Comment()
10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)

[327]Sinter Bonding with Low Melting Point Micro Particle Paste

*Kokone KOIKE1, Tatsuya KOBAYASHI1, Ikuo SHOHJI1, Ko FUKUSHIMA2, Masayuki SASAKI2 (1. Graduate School of Science and Technology, Gunma Univ., 2. SAKATA INX)
Comment()
10:15 AM - 10:30 AM JST(1:15 AM - 1:30 AM UTC)

[328]Evaluation of the Bonding Properties of Zinc-Coated Aluminum Particles
Treated with Metal Salt Coating

*Tomoya IWAZAKI1, Ikuo SHOHJI1, Shinji KOYAMA1, Tatsuya KOBAYASHI1 (1. Graduate School of Science and Technology, Gunma Univ.)
Comment()
10:30 AM - 10:45 AM JST(1:30 AM - 1:45 AM UTC)

break

10:45 AM - 11:00 AM JST(1:45 AM - 2:00 AM UTC)

[329]Growth Mechanism and its Kinetic Analysis of Intermetallic Compounds Formed in Cu/(Sn-9Zn) Diffusion Couples

*Takahiro Mashiko1, Naru Tokunaga2, Minho Oh3, Equo Kobayashi3 (1. Science Tokyo, 2. Science Tokyo(Now with IBM Japan Sys. Eng.), 3. Science Tokyo)
Comment()
11:00 AM - 11:15 AM JST(2:00 AM - 2:15 AM UTC)

[330]Interfacial Reaction between Pd-Cu-Ag Probe for Semiconductor Inspection and Sn-3.0Ag-0.5Cu

*Rin hashizume1, Tatsuya Kobayashi1, Ikuo Shohji1, Tomohisa Hoshino2, Kenichi Sato2, Shunsuke Kobayashi2, Naohito Odani2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo)
Comment()
11:15 AM - 11:30 AM JST(2:15 AM - 2:30 AM UTC)

[331]Abrasion Resistance Properties of Cellulose Nanofiber Composite Ni Plating Film

*Takuya Katsushima1, Tatsuya Kobayashi1, Ikuo Shohji1 (1. Graduate School of Science and Technology, Gunma Univ.)
Comment()
11:30 AM - 11:45 AM JST(2:30 AM - 2:45 AM UTC)

[332]Effect of pH on the Formation of Cu Plating Films Using CNF-Containing Cu Plating Solutions

*Rin MATSUZAWA1, Ikuo Shohji1, Tatsuya Kobayasi1 (1. Graduate School of Science and Technology, Gunma Univ.)
Comment()
11:45 AM - 12:00 PM JST(2:45 AM - 3:00 AM UTC)

[333]Characterization of CNF Composite Ag Plating Films Fabricated by Electrodeposition

*Sota MORI1, Ikuo SHOHJI1, Tatsuya KOBAYASHI1 (1. Graduate School of Science and Technology, Gunma Univ.)
Comment()
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