講演情報
[16a-K103-8]Towards accurate CMP simulations: Bridging experimental data and
numerical models for 6-in SiC wafers
〇Roberto Iaconi1, Riku Tanaka1, Kevin Operiano1, Susumu Maeda1, Fumiya Kawate1, Sepasy Saeed2, Yoshifumi Watanabe2, Atsunobu Une3 (1.Aixtal Corporation, 2.Mipox Corporation, 3.National Def Acad)
キーワード：
Polishing、Simulation、Semiconductor
SiC is a very hard and difficult-to-polish material, it is therefore essential to optimise its processing for an efficient mass production. As part of this effort, we systematically explored physical parameters sets that produce simulation results closely matching 6-in wafers' experimental data. This comprehensive parameter search serves as a preparatory step toward achieving highly accurate simulation outcomes, paving the way for improved CMP optimization strategies.