[1E06-08] 4. Fine Particles, Nanoparticles and Nanomaterials

11:20 AM - 11:40 AM JST(2:20 AM - 2:40 AM UTC)

[1E07] Evaluation of low-temperature sinter bonding of Cu microparticle/Cu_XO nanoparticle composite paste.

*Takashi Aso¹, Hiroki Tsukamoto¹, Tetsu Yonezawa¹ (1. Graduate School of Engineering, Hokkaido University (Japan))

Keywords:

Copper particles,Die-bonding,low-temperature sintering

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