Session Details

[B-6]3D NAND Flash Memory

Wed. Sep 4, 2024 10:45 AM - 12:15 PM JST
Wed. Sep 4, 2024 1:45 AM - 3:15 AM UTC
Room B (408)(4th Floor)
Session Chair: Ken Takeuchi (The Univ. of Tokyo), Keiji Hosotani (KIOXIA Corp.)

[B-6-01 (Invited)]Metal Induced Lateral Crystallization (MILC) Techniques for Highly Scalable Vertical Si Channel in 3D Flash Memory

〇Noritaka Ishihara1, Yusuke Shimada1, Takamitsu Ochi1, Satoshi Seto1, Haruki Matsuo1, Hiroki Yamashita1, Sho Morita1, Masafumi Ukishima1, Yusuke Arayashiki1, Suzuka Kajiwara1, Katsuya Nishiyama1, Akiyuki Murayama1, Kikuko Sugimae1, Shinji Mori1, Yuta Saito1, Takeshi Shundo1, Aki Maeda1, Hiroyuki Kamiya2, Yasuhiro Uchiyama1, Makoto Fujiwara1, Fumiki Aiso1, Katsuyuki Sekine1, Norio Ohtani1 (1. Kioxia Corporation (Japan), 2. Western Digital Corporation (Japan))

[B-6-02]Optical Emission Spectrum Feature-based Machine Learning Technology for Monitoring High Aspect Ratio Contact Etching-induced Defects of 3D NAND Flash Memory

〇Byung Yong Choi1, Gae-won You1, Deokwon Sim1, Jongik Hong1, Hyun Soo Lee1, Jonghyun Kim1, Sangwon Baek1, Won Jun Choi1, Minsun Ryu1, Seungyoon Kim1, Hoyun Jung1, Jun Haeng Lee1, Sung-Il Cho1, Mincheol Park1, Bong-Tae Park1, Sung Hoi Hur1 (1. Samsung Electronics Co., Ltd. (Korea))

[B-6-03]Analysis of Mechanical Stress Induced in Multi-Stack and Number of Wordlines of 3D NAND Flash Memory

〇Donghyun Kim1, Kihoon Nam1, Chanyang Park1, Jiyoon Kim1, Jinsu Jung1, Sanguk Lee1, Yunsu Kim2, Seongjo Park2, Rock-Hyun Baek1 (1. Pohang Univ. of Science and Technology (Korea), 2. SK hynix Inc. (Korea))

[B-6-04]First Demonstration of 3D Stacked FeFET Memory Devices with Vertical IGZO Channel-Last Process for Dense Non-Volatile Memory

〇Roman Izmailov1,2, Nicolò Ronchi1, Jie Li1, Mihaela Ioana Popovici1, Kostantine Katcko1, Zhuo Chen1,2, Laurent Breuil1, Nina Bazzazian1, Kaustuv Banerjee1, Iuliana Rachita1, Geert Van den bosch1, Maarten Rosmeulen1, Jan Van Houdt1,2 (1. imec (Belgium), 2. KU Leuven (Belgium))

[B-6-05]A Novel Structure Using P-doped Polysilicon in IGZO Channel-based 3D NAND Flash

Daewoong Kang1, 〇Minkyo Suh1,2, Gwansun Choi1,2, Chaeyeon Jung1,3, Youngho Jung4 (1. Seoul National University (Korea), 2. Chung-Ang University (Korea), 3. Soongsil University (Korea), 4. Daegu University (Korea))