Session Details
[10a-N102-1~9]KS5 Atomic Layer Process Group
Thu. Sep 10, 2026 9:00 AM - 12:00 PM JST
Thu. Sep 10, 2026 12:00 AM - 3:00 AM UTC
Thu. Sep 10, 2026 12:00 AM - 3:00 AM UTC
N102 (First Year Education Bld. N Block)
[10a-N102-1][Invited Talk] Atomic layer deposition for oxide semiconductors
〇Takanori Takahashi1, Yukiharu Uraoka1 (1.NAIST)
[10a-N102-2]Deposition Characteristics of In2O3 by ALD Using a Microwave Remote Plasma Source
〇Satoshi Maruya1, Tamai Toshihiro1, Takahashi Takanori2, Uraoka Yukiharu2 (1.HORIBA STEC, 2.NAIST)
[10a-N102-3]Low-Temperature Crystallization of ZnO Thin Films via In Situ Plasma Bias ALD
〇Kosuke Ozawa1, Ryo Miyazawa1, Masanori Miura1, Bashir Ahmmad Arima1, Fumihiko Hirose1 (1.Yamagata Univ.)
[10a-N102-4]Observation of competitive adsorption of TDMAT and TMA at sequential adsorption in room temperature atomic layer deposition
〇Hajime Kobayashi1, Ryo Miyazawa1, Masanori Miura1, Bashir Ahmmad Arima1, Fumihiko Hirose1 (1.Yamagata Univ)
[10a-N102-5]Temperature Dependence of the Growth Behavior of AlOx Thin Films Deposited by Plasma-Enhanced and Thermal Atomic Layer Deposition
〇Kohei Matsuo1, Naohiro Furutani1, Tomoki Uehara1, Takayuki Kobayashi1 (1.Samco Inc.)
[10a-N102-6][Invited Talk] Inside High Aspect Ratio Structures in Atomic Layer Processes: Measurement-Driven Visualization of Reactive Species Transport and Reaction Depth
〇Takayoshi Tsutsumi1 (1.Nagoya Univ.)
[10a-N102-7]Highly Flexible Control of Three-Dimensional Deposition Profiles Utilizing Film Property Distribution Formed by Atomic-Layer-Deposition (ALD) Process
〇Takashi Hamano1, Nobuyuki Kuboi1, Shoji Kobayashi1 (1.Sony Semiconductor Solutions Corporation)
[10a-N102-8]Simplified Evaluation of Particle Arrival Characteristics in ALD Chamber Design
〇Akihiko Inada1, Kanomata Kensaku1, Sato Eiji1 (1.Creative Coatings Co., Ltd.)
[10a-N102-9]Atomic layer deposition of p-type SnO thin films using a liquid precursor, Sn(EtCp)2.
〇Fumikazu Mizutani1, Nobutaka Takahashi1, Tomomi Sawada2, Toshihide Nabatame2 (1.Kojundo Chem. Lab., 2.NIMS)
