Session Details

[16a-B1-1~11]13.4 Si processing /Si based thin film / MEMS / Equipment technology

Mon. Sep 16, 2024 9:00 AM - 12:00 PM JST
Mon. Sep 16, 2024 12:00 AM - 3:00 AM UTC
B1 (Exhibition Hall B)
Tatsuya Okada(Univ. of the Ryukyus), Yan Wu(Tokyo Inst. of Tech.)

[16a-B1-1]Wafer loading and wafer transfer system under vacuum in Minimal Fab

〇Shiro Hara1,2,3, Shuichi Noda1, Hitoshi Maekawa1 (1.AIST, 2.MINIMAL, 3.Hundred Semi)
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[16a-B1-2]Analysis of wafer-to-wafer variation of devices fabricated in Minimal Fab

〇Hiroyoshi Hongoh1, Shiro Hara1,2,3 (1.MINIMAL, 2.AIST, 3.Hundred)
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[16a-B1-3]Control of NMOS characteristics in minimal fab SOI-CMOS

〇Takeshi Hamamoto1, Akihiro Yamazaki2, Shiro Hara1,2,3 (1.MINIMAL, 2.AIST, 3.Hundred)
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[16a-B1-4]Formation of HfNx Films Using Minimal Fab Reactive Sputtering Tool

〇Shuichi Noda1, Yuuki Yabuta3, Naoko Yamamoto3, Ryuichiro Kamei3, Shiro Hara1,2,4 (1.AIST, 2.MINIMAL, 3.Seinan-Kogyo, 4.Hundred Semiconductors)
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[16a-B1-5]Study of Device Process Using Minimal Fab Ion Implantation Tool (II)

〇Noriko Miura1, Takeshi Hamamoto2, Kazushige Sato2, Naoki Hashimoto3, Yoshitaka Kitamura3, Shiro Hara1,2,4 (1.AIST, 2.MINIMAL, 3.FUJI IMVAC INC., 4.Hundred)
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[16a-B1-6]Surface treatment of columnar structures by hydrogen annealing using Minimal Fab

〇Kengo Hamada1,2, Ying Huang4, Noriko Sato4, Takashi Chiba1,2, Masao Terada1,2, Kazushige Sato1,2, Yoshiaki Kanamori4, Shiro Hara2,3 (1.SAKAGUCHI ELECTRIC HEATERS, 2.MINIMAL, 3.AIST, 4.Tohoku University)
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[16a-B1-7]Study of hydrogen annealing effect in tapered TSV holes Ⅱ

〇Hiroyuki Tanaka1, Hiroshi Tokunaga2, Yoshiyuki Nozawa3, Toshihiro Hayami3, Kazushige Sato4,6, Kayo Tanoue5, Shiro Hara1,6 (1.AIST, 2.MTC, 3.SPPT, 4.SAKAGUCHI, 5.KB, 6.MINIMAL)
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[16a-B1-8]Application study of hydrogen atmosphere surface treatment using minimal laser heating equipment to semiconductor CMOS devices

〇kazushige sato1,2, Takashi Chiba1,2, Masao Terada1,2, Kengo Hamada1,2, Shiro Hara1,3 (1.MINIMAL, 2.SAKAGUCHI ELECTRIC HEATERS, 3.AIST)
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[16a-B1-9]The effect by the stirring device on a wafer using Minimal-Fab Spin-on Dopant Process

〇Shuhei Nakamichi1, Hiroyoshi Hongoh1, Kazushige Sato1, Fumito Imura3, Shiro Hara1,2,3 (1.MinimalFab, 2.AIST, 3.Hundred)
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[16a-B1-10]Drying Process in spin droplet cleaning

〇Kazumasa Nemoto1, Takashi Yajima2, kazushige Sato2, Noriko Miura1, Shiro Hara1,2,3 (1.AIST, 2.Minimal Fab, 3.Hundred)
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[16a-B1-11]Drying tool of wafer cleaning process in wafer manufacturing for Minimal Fab Ⅲ

〇Takashi Yajima1, Tatsuya Fujita3, Kazumasa Nemoto2, Fumito Imura3, Shiro Hara1,2,3 (1.minimalfab, 2.AIST, 3.Hundred)
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