[OP-01]Welcome Address
○Seiichi Miyazaki1(1. General Chair, Organizing Committee)
You can search for presentations in this event.
SearchYou can search for presentations in this event.
SearchSearch Results(612)
○Seiichi Miyazaki1(1. General Chair, Organizing Committee)
○Toshiro Hiramoto1(1. President, The Japan Society of Applied Physics)
○Huili Grace Xing1(1. Cornell Univ. (USA))
○Meng-Fan (Marvin) Chang1(1. Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan))
○Atsuyoshi Koike1(1. Rapidus Corp. (Japan))
○James S. Clarke1(1. Intel Corp. (USA))
○Hiroki Ago1(1. Kyushu Univ. (Japan))
○Ryo Nanae1, Satsuki Kitamura1, Yih-Ren Chang1,2, Tomonori Nishimura1, Keisuke Shinokita3, Kazunari Matsuda3, Kosuke Nagashio1(1. the Univ. of Tokyo (Japan), 2. RIKEN (Japan), 3. Kyoto Univ. (Japan))
○Satsuki Kitamura1, Ryo Nanae1, Yih Ren Chang1,2, Tomonori Nishimura1, Kosuke Nagashio1(1. The Univ. of Tokyo (Japan), 2. RIKEN (Japan))
○Issei Pribyl1, Taiki Nakagawa1, Kyosuke Uchiyama1, Kohki Mukai1(1. Yokohama National Univ. (Japan))
○Shuhong Li1, Tomonori Nishimura1, Kosuke Nagashio1(1. Univ. of Tokyo (Japan))
○Taro Kato1, Takahisa Tanaka2, Ken Uchida1(1. Univ. of Tokyo (Japan), 2. Keio Univ. (Japan))
○Ryosuke Kajikawa1, Takamasa Kawanago1, Iriya Muneta1, Takuya Hoshii1, Kuniyuki Kakushima1, Kazuo Tsutsui1, Hitoshi Wakabayashi1(1. Tokyo Institute of Technology (Japan))
Chi Liu1,2, ○Xiaoyue Wang1,2, Haiyan Jiang1,2, Xuqi Yang1,2, Zhongying Xue3, Zengfeng Di3, Dongming Sun1,2(1. Inst. of Metal Res., Chinese Academy of Sci. (China), 2. Univ. of Sci. and Tech. of China (China), 3. Shanghai Inst. of Microsystem and Info. Tech., Chinese Academy of Sci. (China))
○Tianshun Xie1, Mengnan Ke2, Nobuyuki Aoki3(1. Chiba Univ. (Japan), 2. Chiba Univ. (Japan), 3. Chiba Univ. (Japan))
○Han Hsiang Tai1, Yu Yuan Su1, Jer Chyi Wang1,2,3, Wen Hao Chang4,5, Chao Sung Lai1,6,7(1. Department of Electronic Engineering, Chang Gung Univ. (Taiwan), 2. Department of Neurosurgery, Chang Gung Memorial Hospital (Taiwan), 3. Department of Electronic Engineering, Ming Chi Univ. of Tech. (Taiwan), 4. Research Center for Applied Sciences, Academia Sinica (Taiwan), 5. Department of Electrophysics, National Yang Ming Chiao Tung Univ. (Taiwan), 6.Department of Nephrology, Chang Gung Memorial Hospital (Taiwan), 7.Department of Materials Engineering, Ming Chi Univ. of Tech. (Taiwan))
○Matt Brubaker1, Alexana Roshko1, Todd Harvey1, Kris Bertness1(1. National Inst. of Standards and Tech. (United States of America))
○Hiroyuki Shimada1, Hironobu Kariyazono1, Yohei Nakagawa1, Shinji Terao1, Kentaro Takayanagi1, Koichiro Akasaka1, Shunsuke Ishizawa1, Koichi Morozumi2, Rie Togashi3, Katsumi Kishino3(1. Core Tech. Development Dept., Seiko Epson Corp. (Japan), 2. Material Analysis & CAE Center, Seiko Epson Corp. (Japan), 3. Sophia Nanotech. Res. Center, Sophia Univ. (Japan))
○Taiki Sakai1, Akio Ohta2, Noriyuki Taoka3, Junji Yuhara1, Katsunori Makihara1, Yuji Yamamoto4, Wei-chen Wen4, Seiichi Miyazaki1(1. Nagoya Univ. (Japan), 2. Fukuoka Univ. (Japan), 3. Aichi Inst. of Tech. (Japan), 4. IHP (Germany))
○Supawan Ngamprapawat1, Jimpei Kawase1, Tomonori Nishimura1, Kenji Watanabe2, Takashi Taniguchi2, Kosuke Nagashio1(1. Univ. of Tokyo (Japan), 2. NIMS (Japan))
Manami Okamoto1, Tomoya Akamatsu1, Katsuhiro Tomioka1, ○Junichi Motohisa1(1. Hokkaido Univ. (Japan))
○Yu- An Lai1, Chin-Te Wang1, Yu-An Chou1, Shun-Tsung Lo1, Thi Hien Do1, Sheng-Di Lin1(1. National Yang Ming Chiao Tung University (Taiwan))
○Yang Xu1, Jiayi Wang1, Nannan You1, Hong Dong3, Weihua Wang3, Xuelei Liang4, Shengkai Wang1,2(1. Inst. of Microelectronics of Chinese Academy of Sci. (China), 2. Univ. of Chinese Academy of Sci. (China), 3. Department of Electronic Sci. and Eng. and Tianjin Key Lab. of Photo-Electronic Thin Film Device and Tech., Nankai Univ. (China), 4. Key Lab. for the Physics and Chemistry of New Device, Peking Univ. (China))
○Yuqing Huang1,2, Irina A. Buyanova1, Weimin M. Chen1(1. Linköping Univ. (Sweden), 2. Inst. of Semiconductors, Chinese Academy of Sciences (China))
○HENG XIANG1, Yu-Chieh Chien1, Lingqi Li1, Haofei Zheng1, Sifan Li1, Yufei Shi1, Kah-Wee Ang1,2(1. National Univ. of Singapore (Singapore), 2. Inst. of Materials Res. and Eng. (Singapore))
○Samarth Jain1, Sifan Li1, Jianze Wang1, Xuanyao Fong1, Kah-Wee Ang1,2(1. National University of Singapore (Singapore), 2. Institute of Materials Research and Engineering, A*STAR (Singapore))
○Hanxi Li1, Jiayang Hu1, Anzhe Chen1, Yishu Zhang1, Yang Xu1, Bin Yu1(1. Zhejiang university (China))
○Yonghun Kim1(1. Korea Institute of Materials Science (Korea))
○Xinfeng Liu1(1. National Center for Nanoscience and Tech. (China))
○Yuchen Gu1, Mengyu Zhao2, Zhihan Liu2, Junru Qu1, Ying Sun1, Yinfan Ouyang2, Wei Sun2, Ran Cheng1(1. Univ. of Zhejiang (China), 2. Univ. of Peking (China))
○Ryuichi Nakajima1, Tomonori Nishimura1, Keiji Ueno2, Yasumitsu Miyata3, Kosuke Nagashio1(1. The Univ. of Tokyo (Japan), 2. Saitama Univ. (Japan), 3. Tokyo Metropolitan Univ. (Japan))
○Jiayang Hu1, Hanxi Li1, Yishu Zhang1, Yang Xu1, Bin Yu1(1. Zhejiang Univ. (China))
○Yoshifumi Morita1, Takuya Iwasaki2, Kenji Watanabe2, Takashi Taniguchi2(1. Gunma Univ. (Japan), 2. National Inst. for Material Sci. (Japan))
○Takuya Iwasaki1, Yoshifumi Morita2, Kenji Watanabe1, Takashi Taniguchi1(1. NIMS (Japan), 2. Gunma Univ. (Japan))
○Loïc Baudoin1, Arthur Arnaud1, Sébastien Massenot2, Pierre Magnan2(1. STMicroelectronics (France), 2. ISAE SUPAERO Univ. of Toulouse (France))
○Seigo Tarucha1(1. RIKEN (Japan))
○Tokio Futaya1, Raisei Mizokuchi1, Misato Taguchi2, Takuji Miki2, Makoto Nagata2, Jun Yoneda1, Tetsuo Kodera1(1. Tokyo Tech. (Japan), 2. Kobe Univ. (Japan))
○Chihiro Kondo1, Raisei Mizokuchi1, Jun Yoneda1, Tetsuo Kodera1(1. Tokyo Inst. of Tech. (Japan))
○Ting Tsai1, I-Hsiang Wang1, Chi-Cheng Lai1, David M.T. Kuo2, Pei-Wen Li1(1. National Yang Ming Chiao Tung University (Taiwan), 2. National Central University (Taiwan))
○Ryuta Tsuchiya1(1. Hitachi, Ltd. (Japan))
○Sanghyeon Kim1, Jaeyong Jeong1, Seong Kwang Kim1, Yoon-Je Suh1, Jisung Lee2, Joonyoung Choi3, Juhyuk Park1, Joon Pyo Kim1, Bong Ho Kim1, Younjung Jo3, Dae-myeong Geum4, Seung-Young Park2, Jongmin Park5(1. KAIST (Korea), 2. KBSI (Korea), 3. KNU (Korea), 4. CBNU (Korea), 5. KANC (Korea))
○Masahiro Hori1, Jinya Kume1, Yukinori Ono1(1. Shizuoka Univ. (Japan))
○Farah Basaric1,4, Anton Faustmann1,4, Alexander Pawlis2,4, Patrick Zellekens3,5,6, Russel Deacon3,5, Benjamin Bennemann2,4, Detlev Grützmacher2,1,4, Koji Ishibashi3,5, Thomas Schäpers1,4(1. Peter Grünberg Inst. 9, Res. center Jülich (Germany), 2. Peter Grünberg Inst. 10, Res. center Jülich (Germany), 3. RIKEN Center for Emergent Matter Sci. (Japan), 4. JARA-Fundamentals of Future Info. Tech., Jülich-Aachen Res. Alliance, Research center Jülich and RWTH Aachen Univ. (Germany), 5. RIKEN Advanced Device Lab. (Japan), 6.Special Postdoctoral Res. Program (SPDR), RIKEN (Germany))
○Shunsuke Ota1,2, Junliang Wang3, Hermann Edlbauer3, Yuma Okazaki2, Shuji Nakamura2, Takehiko Oe2, Arne Ludwig4, Andreas D Wieck4, Tetsuo Kodera1, Christopher Bauerle3, Shintaro Takada2, Nobu-Hisa Kaneko2(1. Tokyo Tech (Japan), 2. AIST (Japan), 3. Inst. Neel (France), 4. Ruhr-Univ. Bochum (Germany))
○Yudai Asano1, Kyosuke Hayasaka1, Mayu Ueda1, Kosuke Kimura2,3, Takashi Tanii1, Shinobu Onoda2, Shinpei Enomoto4, Hiroshi Kawarada1,4(1. Waseda Univ. (Japan), 2. National Inst. of Quantum and Radiological Sci. and Tech. (Japan), 3. Gunma Univ. (Japan), 4. Kagami Memorial Res. Inst. for Materials Sci. and Tech. (Japan))
○Tian Li1, Masahiro Koike1, Toshiya Murakami1, Shiho Murakami1, Nobuyuki Umetsu1, Hiroki Tokuhira1, Michael Quinsat1, Masatoshi Yoshikawa1(1. Kioxia Corp. (Japan))
○Baofang Cai1, Xue Zhang2, Zhifeng Zhu2, Gengchiau Liang1(1. National Univ. of Singapore (Singapore), 2. ShanghaiTech Univ. (China))
○Chuhan Liu1, Yuichiro Kurokawa1, Naoki Hashimoto1, Terumitsu Tanaka1, Hiromi Yuasa1(1. Kyushu University (Japan))
○Kenta Takabayashi1, Masaaki Tanaka2,3, Pham Nam Hai1,3(1. Department of Electrical and Electronic Eng., Tokyo Inst. of Tech. (Japan), 2. Department of Electrical Engineering and Info. System, The Univ. of Tokyo, Tokyo 113-8656 (Japan), 3. Center for Spintronics Res. Network (CSRN), The Univ. of Tokyo, Tokyo 113-8656 (Japan))