[A-1-1]Silicon/Ge/Silica monolithic photonic integration for telecommunications applications.
K. Yamada1, T. Tsuchizawa1, H. Nishi1, R. Kou1, T. Hiraki1, H. Fukuda1, Y. Ishikawa2, K. Wada2(1.NTT Corporation, 2.Univ of Tokyo , Japan)
You can search for presentations in this event.
SearchYou can search for presentations in this event.
SearchSearch Results(665)
K. Yamada1, T. Tsuchizawa1, H. Nishi1, R. Kou1, T. Hiraki1, H. Fukuda1, Y. Ishikawa2, K. Wada2(1.NTT Corporation, 2.Univ of Tokyo , Japan)
J. Fujikata1,2, M. Takahashi1,3, S. Takahashi1,2, T. Akagawa1,2, M. Noguchi1,2, T. Horikawa1,3, T. Nakamura1,2, Y. Arakawa1,4(1.PECST, 2.PETRA, 3.AIST, 4.Univ. of Tokyo , Japan)
T. Akagawa1,2, S. Akiyama1,2, T. Baba1,2, M. Imai1,2, T. Usuki1,2(1.Inst. for Photonics-Electronics Convergence System Tech. (PECST), 2.Photonics Electronics Tech. Research Association (PETRA) , Japan)
R. Kuroyanagi1, M. L. Nguyen1, T. Tsuchizawa2, Y. Ishikawa1, K. Yamada2, K. Wada1(1.Univ. of Tokyo, 2.NTT Microsystem Tech. Labs., NTT Corp. , Japan)
D. Van Thourhout1, S. Keyvaninia1, G. Roelkens1, M. Lamponi2, F. Lelarge2, J. M. Fedeli3, S. Messaoudene3, G.D. Duan2(1.Ghent Univ.-IMEC , Belgium, 2.III-V lab, 3.CEA-LETI , France)
T. Matsumoto1, S. Sekiguchi1, T. Kurahashi1, K. Morito1(1.Fujitsu Labs. , Japan)
H. Takahasi1,2, M. Toyama1,3, M. Seki1,3, D. Shimura1,2, K. Koshino1,3, N. Yokoyama1,3, M. Ohtsuka1,3, A. Sugiyama1,3, E. Ishitsuka1,3, T. Sano1,3, T. Horikawa1,3(1.Inst. for Photonics-Electronics Convergence System Tech.(PECST), 2.Photonics Electronics Tech. Research Association(PETRA), 3.National Inst. of Advanced Industrial Science and Tech.(AIST) , Japan)
N. Hirayama1,2, H. Takahashi1,3, Y. Noguchi1,2, M. Yamagishi1,2, T. Horikawa1,2(1.Inst. for Photonics-Electronics Convergence System Tech., 2.National Inst.of Advanced Industrial Science and Tech., 3.Photonics Electronics Tech. Res. Association , Japan)
H. Takami1, K. Makihara1, M. Ikeda2, S. Miyazaki1(1.Univ. of Nagoya, 2.Univ. of Hiroshima , Japan)
Y. H. Hsiao1, S. Iwamoto1, Y. Arakawa1(1.Univ. of Tokyo , Japan)
H. Omi1,2, Y. Abe1, M. Anagnosti1, T. Tawara1,2(1.NTT Basic Research Labs., NTT Corp, 2.Nanophotonics Center, NTT Corp. , Japan)
T. Nakajima1, T. Shinagawa1, T. Kimura1, H. Isshiki1, T. Sugawara2, Y. Jiang2(1.Univ. of Electro-Communications, 2.Shincron Co. Ltd. , Japan)
M. Nara1, T. Kita1, Y. Tanushi1, H. Yamada1(1.Tohoku Univ. , Japan)
N. Mizuochi1(1.Osivaka Univ. , Japan)
Y. Yasunaga1, H. Ueyama1, K. Morita1, T. Kitada1, T. Isu1(1.Univ. of Tokushima , Japan)
K. Kurokawa1, N. Hanzawa1(1.NTT Corp. , Japan)
K. Hitachi1, A. Ishizawa1, T. Nishikawa1, M. Asobe2, T. Sogawa1(1.NTT Basic Res. Lab., 2.NTT Photonics Lab. , Japan)
M. Qiu1,2, X. Chen2, Y. Chen2, M. Yan2(1.Department of Optical Engineering, Zhejiang Univ. , China, 2.School of Information and Communication Tech., Royal Inst. of Tech. (KTH) , Sweden)
W. H. Hsu1, M. H. Shih2, H. C. Kuo1(1.Univ. of National Chiao-Tung, 2.Academia Sinica , Taiwan)
K. T. Lai1,2, M. Y. Kuo1, K S. Hsu1,3, C. T. Lin2, M. H. Shih1,3(1.Academia Sinica, 2.National Chiao Tung Univ., 3.National Chiao Tung Univ. , R.O.C. (Taiwan))
G. Shambat1, B. Ellis1, A. Majumdar1, J. Petykiewicz1, M. Mayer2, T. Sarmiento1, J. Harris1, E. Haller2, J. Vuckovic1(1.Electrical engineering department, Stanford Univ., 2.Department of of Materials Science, Univ. of California, , USA)
X. Xu1, T. Tsuboi1, T. Chiba1, T. Maruizumi1, Y. Shiraki1(1.Tokyo City Univ. , Japan)
R. Ohta1, Y. Ota1, H. Takagi1, N. Kumagai1, K. Tanabe1, S. Ishida1, S. Iwamoto1, Y. Arakawa1(1.Univ. of Tokyo , Japan)
H. P.M.M. Ambrosius1, X. J.M. Leijtens1, M. K. Smit1(1.Eindhoven Univ. of Tech. , The Netherlands)
Y. Yoshioka1,2, N. Yamamoto1, K. Akahane1, T. Kawanishi1, M. Kuroda1, H. Takai2(1.NICT, 2.Tokyo Denki Univ , Japan)
A. Hayakawa1, H. Z. Song1, T. Matsumoto1, M. Matsuda1, T. Kageyama2, Y. Yokoyama2, K. Nishi2,3, K. Takemasa2,3, M. Ekawa1, Y. Tanaka1, T. Yamamoto1,2, M. Sugawara2,3, Y. Arakawa3,4(1.Fujitsu Laboratories Ltd., 2.QD Laser, Inc., 3.Inst. for Nano Quantum Info. Electronics, 4.The Univ. of Tokyo , Japan)
K. Morita1, H. Ueyama1, Y. Yasunaga1, Y. Nakagawa1,2, T. Kitada1, T. Isu1(1.Univ. of Tokushima, 2.NICHIA Corp. , Japan)
J. M. Wun1, J. W. Shi1, C. Y. Tsai1, Y. M. Hsin1(1.Univ. of National Central Univ. , Taiwan)
J. M. Wun1, J. W. Shi1(1.National Central Univ. , Taiwan)
T. Hiraki1,2, R. Kou1,2, H. Nishi1,2, H. Fukuda1,2, T. Tsuchizawa1,2, Y. Ishikawa3, K. Wada3, K. Yamada1,2(1.NTT Microsystem Integration Labs., 2.Nanophotonics Center, NTT Corp. , Japan, 3.Univ. of Tokyo , Japna)
L. Virot1,2,3, L. Vivien1, J. M. Hartmann2, J. M. Fedeli2, D. Marris Morini1, E. Cassan1, C. Baudot3, F. Boeuf3(1.Univ. Paris-Sud, 2.CEA LETI, 3.STMicroelectronics , France)
J. Fujikata1,2, M. Noguchi1,2, M. Miura1,2, D. Okamoto1,2, T. Horikawa1,3, Y. Arakawa1,4(1.PECST, 2.PETRA, 3.AIST, 4.Univ. of Tokyo , Japan)
X. Wang1, H. Li1, R. Camacho2, Y. Cai2, L. C. Kimerling2, M. Jurgen2, J. Liu1(1.Dartmouth College, 2.Massachusetts Inst. of Tech. , USA)
Y. Mizuno1, Y. Ishikawa1, K. Wada1(1.Univ. of Tokyo , Japan)
W. T. Lai1, P. H. Liao1, A. Homyk2, A. Scherer2, P. W. Li1(1.National Central Univ. , Taiwan, 2.California Inst. of Tech. , USA)
Y. Hwang1, J. Park1, G. Y. Jin1, C. Chung1(1.Samsung Electronics Co., Ltd. , Korea)
T. Imamoto1,2, T. Endoh1,2(1.Tohoku Univ., 2.JST-CREST , Japan)
T. Ishizu1, H. Inoue1, T. Matsuzaki1, S. Nagatsuka1, Y. Okazaki1, T. Onuki1, A. Isobe1, Y. Shionoiri1, K. Kato1, T. Okuda1, J. Koyama1, S. Yamazaki1(1.Semiconductor Energy Laboratory Co., Ltd. , Japan)
J. Kim1, T. Youn1, S. Seo1, N. Park1, S. Yi1, E. Park1, H. Kim1, H. Yang1, K. Noh1, S. Park1, S. Lee1(1.SK hynix Inc. , South Korea)
B. S. Jo1, H. J. Kang1, S. M. Joe1, M. K. Jeong1, S. K. Park2, K. R. Han2, B. G. Park1, J. H. Lee1(1.Seoul National Univ., 2.SK Hynix Inc. , Korea)
H. W. H. Ching1, W. Robert1, Y. Kevin1, L. Yen Hsin1, B. Francis1, C. Hsin Ming1, Y. Evans1(1.eMemory Tech. Inc. , Taiwan)
H. B. Chen1, S. H. Lin2, J. J. Wu1, Y. C. Wu2, C. Y. Chang1(1.Univ. of National Chiao Tung Univ., 2.Univ. of National Tsing Hua Univ. , Taiwan)
F. H. Li1, Y. Y. Chiu1, Y. H. Lee1, R. W. Chang1, B. J. Yang1, W. T. Sun2, E. Lee2, C. W. Kuo2, R. Shirota1(1.National Chiao Tung Univ., 2.eMemory Tech. Inc. , Taiwan)
B. Kim1, Y. Song1, H. Jeong1, D. Ha1, Y. Kang1, S. Ahn1, J. Lee1, K. Lee1, D. Ahn1, S. Nam1, G. Jeong1, C. Chung1(1.Samsung Electronics Corp. , Korea)
A. Gyanathan1, Y. C. Yeo1(1.National Univ. of Singapore , Singapore)
H. Funakubo1, A. Sumi1, H. Morioka1, S. Okamoto1, S. Yokoyama1, T. Okamoto1, Y. Ehara1(1.Tokyo Tech. , Japan)
H. Hada1, T. Sakamoto1, M. Tada1, N. Banno1, M. Miyamura1, K. Okamoto1, N. Iguchi1, T. Nohisa1(1.Low-power Electronics Association & Project , Japan)
G. Palma1, E. Vianello1, G. Molas1, C. Cagli1, F. Longnos2, J. Guy1, M. Reyboz1, C. Carabasse1, M. Bernard1, F. Dahmani2, D. Bretegnier2, J. Liebault2, B. De Salvo1(1.CEA, LETI, MINATEC Campus, 2.Altis Semiconductor , France)
P. Huang1, Y. X. Deng1, B. Gao1, B. Chen1, F. F. Zhang1, D. Y1, L. F. Liu1, G. Du1, J. F. Kang1, X. Y. Liu1(1.Peking Univ. , P. R. China)
X. Tong1, W. Wu1, Z. Liu1, X. A. Tran2, H. Y. Yu3, Y. C. Yeo1(1.National Univ. of Singapore, 2.Nanyang Tech. Univ. , Singapore, 3.South Univ. of Sci. and Tech. , China)