Session Details

[SO-PS-04]04: Power / High‐speed Devices and Materials

Wed. Sep 17, 2025 1:30 PM - 2:20 PM JST
Wed. Sep 17, 2025 4:30 AM - 5:20 AM UTC
Room M (414+415, 4th Floor)
Session Chair: Taketomo Sato (Hokkaido Univ.), Joel T. Asubar (Univ. of Fukui)

[SO-PS-04-01]Structures and Stability of Ga2O3 on α-Al2O3(0001) Substrate: A First-Principles Study

〇Koki Ishida1, Toru Akiyama1, Takahiro Kawamura1 (1. Mie university (Japan))

[SO-PS-04-02 (Late News)]Integration of Solution-Processed BaTiO3 Dielectric for Enhancing the High-Voltage Performance of β-Ga2O3 Power Devices

〇Zhiqiang LI1, Wenpeng Zhou1, Jiye Yang1, Zuokai Wen1, Shan Huang1, Hanqin Zhou1, Man Hoi Wong1 (1. The Hong Kong University of Science and Technology (Hong Kong))

[SO-PS-04-03]1.2 kV Hybrid Power Switch Consisting of a PSJ GaN HEMT, a Si IGBT and a SiC Diode

〇Alireza Sheikhan1, Ekkanath Madathil Sankara Narayanan1, Hiroji Kawai2, Shuichi Yagi2, Hironobu Narui2 (1. The University of Sheffield (UK), 2. Powdec K.K. (Japan))

[SO-PS-04-04]Degradation Behaviors Comparation and Analysis of Two Typical Trench SiC MOSFETs Under High Gate Voltage Stress

〇peng liao1, Yanghao Wang1, Jianbin Guo1, QingQing Sun1, David Wei Zhang1, Hang Xu1 (1. The Univ. of Fudan (China))

[SO-PS-04-05]TCAD and Experimental Study of Geometric Components in Charge Pumping Current for Accurate Characterization of Interface Trap Density in SiC pMOSFETs

〇Kazuma Shimura1, Dai Okamoto1, Yuta Taguchi1, Kenta Kimata1, Mitsuru Sometani2, Hirohisa Hirai2, Mitsuo Okamoto2, Tetsuo Hatakeyama1 (1. Toyama Pref. Univ. (Japan), 2. AIST (Japan))

[SO-PS-04-06]Influence of Dummy Gate Layout on Turn-On EMI Noise in Trench IGBTs

Wei Wei1,2, 〇Xiaoli Tian1, Ruixue Mai1,2, Yun Bai1, Yidan Tang1, Jilong Hao1, Xuan Li1, Hong Chen3, Xinhua Wang1, Xinyu Liu1 (1. Inst.of Microelectronics of Chinese Academy of Sciences (China), 2. Univ. of Chinese Academy of Sciences (China), 3. JIEJIE Microelectronics Co. Ltd (China))

[SO-PS-04-07]Orientation Dependence of Structural Stability and Band Alignment for N-incorporated 4H-SiC/SiO2 Interfaces: A DFT-Based Approach

〇Naoto Ise1, Toru Akiyama1, Tetsuo Hatakeyama2, Kenji Shiraishi3, Takashi Nakayama4 (1. Mie University (Japan), 2. Toyama Prefectural University (Japan), 3. Tohoku University (Japan), 4. Chiba University (Japan))

[SO-PS-04-08]Resistivity Control via Dopant Evaporation in Sb-Doped CZ-Si Crystal Growth

〇Takumi Yatai1, Wataru Saito1, Shin-ichi Nishizawa1 (1. Kyushu Univ (Japan))

[SO-PS-04-09]A Surge-Robust Packaging Reinforcement Method for SiC MPS Diodes Using Ag Bonding Metal Foil

〇Zheng Hu1,2, Yidan Tang1, Zhen Dong1,2, Wenlong Liu1,2, Lu Cao1,2, Xinyu Liu1 (1. Institute of Microelectronics, Chinese Academy of Sciences (China), 2. School of Microelectronics, University of Chinese Academy of Sciences (China))

[SO-PS-04-10]Investigation of the Temperature-Dependent Degradation Behaviors in RF Performance of AlGaN/GaN HEMTs Subjected to On-state DC Stress

〇Chun-Yi Hsia1, Yi-Fan Tsao1, Ping-Hsun Chiu1, Chia-Hui Liu1, Chen-Hsuan Hung1, Heng-Tung Hsu1 (1. National Yang Ming Chiao Tung University (Taiwan))

[SO-PS-04-11]Suppression of Leakage and Hysteresis in p-GaN HEMTs by In-situ NH3 Plasma

Jiang Wei Siang1, Phan Thi My Kien1, Chu Chen Ling2, Noriyuki Watanabe3, Toshifumi Konishi3, 〇Tsai Chia Lung1, Ke Wen Cheng2, Horng Ray Hua1,4 (1. Industrial Technology Research Institute (Taiwan), 2. National Taiwan University of Science and Technology (Taiwan), 3. NTT Advanced Technology Corporation (Japan), 4. National Yang Ming Chiao Tung University (Taiwan))

[SO-PS-04-12]Al-rich AlGaN HFET for Extreme Environment Applications

〇Do-Hyeong Yeo1, MyeongSu Chae1, Hyun-Seop Kim2, Hyungtak Kim1, Ho-Young Cha1 (1. Hongik Univ. (Korea), 2. Kunsan National Univ. (Korea))

[SO-PS-04-13]Investigation of the Drain Bias-Dependent Degradation Behaviors in RF Perfor-mance of AlGaN/GaN HEMTs Subjected to High-Temperature DC Stress

〇Chia-Hui Liu1, Yi-Fan Tsao1, Chun-Yi Hsia1, Ping-Hsun Chiu1, Chen-Hsuan Hung1, Heng-Tung Hsu1 (1. National Yang Ming Chiao Tung University (Taiwan))

[SO-PS-04-14]Ultra Low On-Resistance of Novel Quaternary QST Substrate with HfAlO Dielectric Layer HEMT

〇Kuang Ting Hsieh2, Yi Hsuan Chang1, Yan Kuei Wu1, Wei Chou Hsu1,2 (1. Inst. of Microelectronics, Department of Electrical Eng., National Cheng Kung Univ. (Taiwan), 2. Academy of Innovative Semiconductor and Sustainable Manufac., National Cheng Kung Univ. (Taiwan))

[SO-PS-04-15]High-Performance Normally-Off InAlGaN/GaN MOSHEMTs with p-NiOx Gate and Dual Dielectric Structure

〇Yen-Ying Chu1, Yun-Ru Lin1, Yen-Kuei Wu1, Wei-Chou Hsu1 (1. National Cheng Kung Univ. (Taiwan))

[SO-PS-04-16]Realization of N-polar GaN/AlGaN Heterostructures on Silicon Using an AlSiN Polarity Inversion Layer by MOCVD

〇Yin-Nan Wang1, Chia-Yu Hsieh1, Hsin-Ning Li1, Hung-Yang Lin1, Jen-Inn Chyi1, Yue-ming Hsin1 (1. National Central Univ. (Taiwan))

[SO-PS-04-17]Bias and Temperature Dependence of Threshold Voltage Instability Induced by Low Drain Bias in E-mode AlGaN/GaN HEMTs

〇Myeongsu Chae1, Hyungtak Kim1 (1. Hongik Univ. (Korea))

[SO-PS-04-18]Grating-Gate THz Plasmonic Detector Based on an InGaAs-channel HEMT with an InP Barrier Layer

〇Masaki Nagatsu1, Kenichi Narita1, Yuma Takida2, Hiroaki Minamide2, Tsung tse Lin1, Akira Satou1 (1. Tohoku Univercity (Japan), 2. RIKEN Center for Advanced Photonics (Japan))

[SO-PS-04-19]Optimizing RF Performance of InGaAs MOSFETs via Indium Composition Engineering

Cheng-Jun Huang1, Jin-Yu Chang1, Yi-Ting Feng1, Jing-Yuan Wu1, Hua-Lun Ko1, Si-Meng Chen1,2, 〇Hsuan-Yao Huang1, Jui-Sheng Wu1, Shuo Hwai3, Edward. Yi Chang1 (1. Nat’l Yang Ming Chiao Tung Univ. (Taiwan), 2. Tokyo Inst. of Tech. (Japan), 3. Univ. of California, Los Angeles (United States of America))

[SO-PS-04-20]Impact of Gate Recess Descum on the DC and RF Characteristics of AlInAs/GaInAs High-Electron Mobility Transistors

〇Fran Kostelac1, Giorgio Bonomo1, Tamara Saranovac1, Diego Marti1, Ralf Flückiger1, Olivier J.S. Ostinelli1, Colombo R. Bolognesi1 (1. ETH Zürich (Switzerland))

[SO-PS-04-21]Growth and Characterization of InGaAs Channel HEMTs on GaAs (100) with Pre-Grown InP Metamorphic Buffer Layers

〇Hyunchul Jang1, Jae-Phil Shim1, Geunuk Han1, Yunji Jeong1, Inseon Song1, Il-Hyeong Lee1, Deoksoo Park1, Eun-kyung Chu1, Seung Heon Shin2, Keun-Man Song1 (1. KANC (Korea), 2. Soonchunhyang Univ. (Korea))

[SO-PS-04-22]Isolation Characteristics of GaN Mesas on Diamond Substrates Fabricated Using the Surface-Activated Bonding

〇Yosei Sunamoto1, Hazuki Tomiyama1, Tetsuya Suemitsu2, Naoteru Shigekawa1, Jianbo Liang1 (1. Osaka Metropolitan University (Japan), 2. Tohoku University (Japan))

[SO-PS-04-23]Thermally Robust 3C-SiC/Diamond and Si (111)/Diamond Templates for Advanced III-Nitride Process

〇Hikaru Iwamoto1, Naoteru Shigekawa1, Jianbo Liang1 (1. Osaka Metropolitan University (Japan))

[SO-PS-04-24]Enhancement-Mode InAlGaN/GaN HEMTs Featuring USPD-Deposited Li-Doped p-NiOx Gates with Low Interface Trap Density

〇Yu-Hsuan Chen1, Yan-Kuei Wu1, Wei-Chou Hsu1 (1. Inst. of Microelectronics, Department of Electrical Engineering, National Cheng Kung Univ. (Taiwan))

[SO-PS-04-25 (Late News)]Improved Device Characteristics of P-GaN/AlGaN/GaN HFET
with Boron Nitride Film

〇Jun Hyeok Yim1, Myeong Su Chae1, Jin Hyeok Pyo1, Sangyeon Pak1, Hyungtak Kim1, Ho-Young Cha1 (1. Hong-Ik Univ. (Korea))