Session Details
[9p-A21-1~15]13.7 Compound and power devices, process technology and characterization
Wed. Sep 9, 2026 2:00 PM - 6:00 PM JST
Wed. Sep 9, 2026 5:00 AM - 9:00 AM UTC
Wed. Sep 9, 2026 5:00 AM - 9:00 AM UTC
A21 (Faculty of Info. Sci. & Tech. Bldg.)
[9p-A21-1]Impact of Electron Irradiation on Channel and Drift Regions in SiC MOSFET
〇(M1)Yuto Ogawa1, Noriyuki Iwamuro1, Hiroshi Yano1 (1.Univ. of Tsukuba)
[9p-A21-2]Effects of Electron Beam Irradiation on Interface Properties of SiC-MOS Capacitors
〇(M2)Soma Furuya1, Noriyuki Iwamuro1, Hiroshi Yano1 (1.Univ. of Tsukuba)
[9p-A21-3]SiC MOSFET with SiC / SiO2 interfaces nitrided by the hot-wire method
〇Tomoki Oku1, Kohei Nishiguchi1, Masahiro Totsuka1, Yasuyuki Nakagawa1, Tomokatsu Watanabe1 (1.Mitsubishi Electric)
[9p-A21-4]Decoupling Effective Field, Screening, and Temperature Dependences of Inversion Layer Mobility in SiC MOSFETs
〇Tetsuo Hatakeyama1, Hirohisa Hirai2, Mitsuru Sometani2, Mitsuo Okamoto2 (1.Toyama Pref. Univ., 2.AIST)
[9p-A21-5]First-principles analysis of SiO2/SiC interface defects: A comparison with SiC bulk defects
〇(D)Sosuke Iwamoto1, Masahiro Hara1, Heiji Watanabe1, Takuma Kobayashi1 (1.UOsaka)
[9p-A21-6]Calculation of electronic states in 4H-Si inversion layer based on the tight-binding model fo conduction band of 4H-SiC
〇Sachika Nagamizo1, Nobuya Mori1 (1.Osaka Univ.)
[9p-A21-7]EDMR spectroscopy on conduction-band-side interface states of 4H-SiC(0001) MOSFETs induced by Fowler-Nordheim stress
〇Bunta Shimabukuro1, Keigo Adachi1, Mitsuru Sometani2, Hirohisa Hirai2, Heiji Watanabe3, Takahide Umeda1 (1.Univ. of Tsukuba, 2.AIST, 3.Univ. of Osaka)
[9p-A21-8]Evaluation of Martens-Type Time Constants in 4H-SiC MOS Capacitors by Multi-Frequency Admittance Analysis
〇Dai Okamoto1, Mitsuru Sometani2 (1.Toyama Pref. Univ., 2.AIST)
[9p-A21-9]Etching of 4H-SiC by Reactive Atmospheric-pressure Thermal Plasma Jet
〇Shoma sy Yamamoto1, Jiawen Yu1, Hiroaki Hanafusa1, Seichiro Higashi1 (1.Hiroshima Univ)
[9p-A21-10]Investigation of Body pin Diodes in SiC MOSFETs Fabricated on Bonded Substrates
〇(M2)Tomohiro Baba1, Hiroshi Yano1, Noriyuki Iwamuro1 (1.Univ. of Tsukuba)
[9p-A21-11]Characteristics Evaluation of SiC JFET Differential Amplifier Under High Temperature
〇Daisuke Watanabe1,2, Takuya Matsunaga1,2, Masayuki Yamamoto1,2, Hitoshi Umezawa1, Takahide Sato2, Shin-Ichiro Kuroki3, Yasunori Tanaka1 (1.AIST, 2.Univ. of Yamanashi, 3.Hiroshima Univ.)
[9p-A21-12]Analysis of On-Resistance Components in SiC MOSFETs and Their Structural Dependence on Short-Circuit Ruggedness
〇(M1)So Uchiyama1, Hiroshi Yano1, Noriyuki Iwamuro1 (1.Univ. of Tsukuba)
[9p-A21-13]High Temperature Operation of 4H-SiC Active Pixel Sensor
〇Yusuke Hata1, Tatsuya Meguro1, Akinori Takeyama2, Takeshi Ohshima2, Kazutoshi Kojima3, Yasunori Tanaka3, Tomonori Maeda1,4, Hiroshi Sezaki1,4, Shin-Ichiro Kuroki1 (1.RISE, Hiroshima Univ, 2.QST, 3.AIST, 4.Phenitec Semiconductor Co., Ltd)
[9p-A21-14]Predicting Projectile Atomic Number Dependence of Electronic Stopping Cross Sections along 4H-SiC <11-23> Direction
〇Kazuhiro Mochizuki1, Tomoaki Nishimura1, Tomoyoshi Mishima1, Fumimasa Horikiri1, Hiroshi Ohta1,2 (1.Hosei Univ., 2.Devise Tech Inc.)
[9p-A21-15]Analog ReRAM Based on Single-Crystal 4H-SiC and Its Operating Mechanism
〇(M1C)Haru Takayama1, Yumeng Zheng1, Kinoshita Kentaro1 (1.Tokyo Univ. of Sci.)
