Session Details
[18p-A23-1~17]Fundamentals and Latest Technology Trends of Atomic Layer Process (ALP)
Wed. Sep 18, 2024 1:30 PM - 7:30 PM JST
Wed. Sep 18, 2024 4:30 AM - 10:30 AM UTC
Wed. Sep 18, 2024 4:30 AM - 10:30 AM UTC
A23 (TOKI MESSE 2F)
Satoshi Hamaguchi(Osaka Univ.), Takeshi Momose(Kumamoto Univ.), Yukihiro Shimogaki(Univ. of Tokyo)
[18p-A23-1]Atomic Layer Deposition using Highly Reactive Reactants and Precursors
〇Hideharu Shimizu1 (1.Taiyo Nippon Sanso)
[18p-A23-2]Reaction pathway analysis and molecular design of ALD precursor using a universal machine learned force field
〇Yusuke Asano1 (1.Preferred Computational Chemistry)
[18p-A23-3]Room-temperature atomic layer deposition and its application for combinative oxide deposition
〇Fumihiko Hirose1 (1.Yamagata Univ.)
[18p-A23-4]Observation of competitive adsorption of DMZ and TMA in sequential adsorption of room temperature atomic layer deposition
〇Haruto Suzuki1, Ryo Miyazawa1, Satoshi Suzaki1, Masanori Miura1, Fumihiko Hirose1 (1.Yamagata Univ.)
[18p-A23-5]High-precision in-situ monitoring of ALD adsorption and reaction processes using QCM
Yuxuan Wu1, Jun Yamaguchi1, Noboru Sato1, Atsuhiro Tsukune1, 〇Yukihiro Shimogaki1 (1.The Univ. Tokyo)
[18p-A23-6]Estimation of Vapor Pressure of Metal Complex for ALD by COSMO-SAC method
〇Noboru Sato1, Yuxuan Wu1, Jun Yamaguchi1, Atsuhiro Tsukune1, Yukihiro Shimogaki1 (1.The Univ. Tokyo)
[18p-A23-7]Surface Reactions in Atomic layer Etching Processing
〇Kazuhiro Karahashi1, Tomoko Ito1, Satoshi Hamaguchi1 (1.Osaka Univ.)
[18p-A23-8]Atomic Layer Etching of Cu Using Alternating Cycles of Hexafluoroacetylacetone and O2 Plasma
〇Yusuke Nakatani1, Andrew Kaye2, Yasushi Sonoda1, Motohiro Tanaka1, Kenji Maeda1, Sumit Agarwal2 (1.Hitachi High-Tech, 2.Colorado School of Mines)
[18p-A23-9]Atomic layer etching of dielectric films using HF containing plasma at low temperature
〇Makoto Sekine1 (1.Nagoya Univ.)
[18p-A23-10]Selective removal of single-layer graphene on SiO2 by remote oxygen plasma
〇(DC)Liugang Hu1, Kenji Ishikawa2, Thi-Thuy-Nga Nguyen2, Shih-Nan Hsiao2, Masaru Hori2 (1.Nagoya Univ., 2.Nagoya Univ. Ctr. Low Temp. Plasma)
[18p-A23-11]Evaluation of RF plasma in ALD chamber and ALD growth of β-Ga2O3 thin films
〇(B)Shodai Ata1, Ryuto Ichikawa1, Keigo Naito1, Takeshi Yoshimura1, Norifumi Fujimura1 (1.Osaka Metropolitan Univ.)
[18p-A23-12]Atomic layer deposition of polycrystalline GaN thin films using GaCp*
〇Fumikazu Mizutani1, Nobutaka Takahashi1 (1.Kojundo Chem. Lab.)
[18p-A23-13]Highly-Selective Co Thin Film Formation Process Utilizing Combined ALD and ALE
〇Jun Yamaguchi1, Noboru Sato1, Atsuhiro Tsukune1, Takeshi Momose1, Yukihiro Shimogaki1 (1.The Univ. Tokyo)
[18p-A23-14]In-situ observation on the initial growth of Co-ALD by optical reflectance monitoring
〇Naoki Tamaoki1, Shunsuke Kimura1, Yoshida Koki1, Yamaguchi Jun1, Sato Noboru1, Tsukune Atsuhiro1, Momose Ken1, Shimogaki Yukihiro1 (1.The University of Tokyo)
[18p-A23-15]Consideration of the effect of HfO2/ZrO2 interfaces on ferroelectric phase formation in HfO2/ZrO2 nanolaminate thin films
〇Takashi Onaya1, Yasuhiro Sakuragawa1, Rina Takahisa1, Koji Kita1 (1.GSFS, The Univ. of Tokyo)
[18p-A23-16]Growth mechanism of ALD-Ga2O3 thin films
〇Ryuto Ichikawa1, Takeshi Yoshimura1, Norifumi Fujimura1 (1.Osaka Metropolitan Univ.)
[18p-A23-17]Crystallographic orientation dependence of HfO2-based ultra-thin film growth on β-Ga2O3
〇(M1)Katsuhiro K Furukawa1, Ryuto Ichikawa1, Shodai Ata1, Takeshi Yoshimura1, Norifumi Fujimura1 (1.Osaka Metro. Univ.)