2024 International Conference on Solid State Devices and Materials
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Sessions(by Program Type)

Oral Presentation

01: Advanced CMOS: Material Science / Process Engineering / Device Technology :

[A-1]Advanced CMOS: Process Technology

Mon. Sep 2, 2024 2:30 PM - 4:00 PM JST
Mon. Sep 2, 2024 5:30 AM - 7:00 AM UTC
Room A (407)(4th Floor)
Session Chair: Genji Nakamura (Tokyo Electron Ltd.), Takashi Matsukawa (AIST)
01: Advanced CMOS: Material Science / Process Engineering / Device Technology :

[A-2]Innovative devices and Sensing technology

Mon. Sep 2, 2024 4:15 PM - 5:30 PM JST
Mon. Sep 2, 2024 7:15 AM - 8:30 AM UTC
Room A (407)(4th Floor)
Session Chair: Hidetoshi Oishi (Sony Semiconductor Solutions Corp.), Shoichi Kabuyanagi (KIOXIA Corp.)
01: Advanced CMOS: Material Science / Process Engineering / Device Technology :

[A-4]Advanced CMOS: Device Technology

Tue. Sep 3, 2024 10:45 AM - 12:15 PM JST
Tue. Sep 3, 2024 1:45 AM - 3:15 AM UTC
Room A (407)(4th Floor)
Session Chair: Anabela Veloso (imec), Keisuke Yamamoto (Kyushu Univ.)
01: Advanced CMOS: Material Science / Process Engineering / Device Technology :

[A-5]Ferroelectric Devices

Wed. Sep 4, 2024 9:00 AM - 10:00 AM JST
Wed. Sep 4, 2024 12:00 AM - 1:00 AM UTC
Room A (407)(4th Floor)
Session Chair: Kasidit Toprasertpong (The Univ. of Tokyo), Shibun Tsuda (Renesas Electronics Corp.)
01: Advanced CMOS: Material Science / Process Engineering / Device Technology :

[A-6]Modeling, Simulation and Characterization

Wed. Sep 4, 2024 10:45 AM - 12:15 PM JST
Wed. Sep 4, 2024 1:45 AM - 3:15 AM UTC
Room A (407)(4th Floor)
Session Chair: Pin Su (NYCU), Nobuyuki Mise (Hitachi High-Tech Corp.)
01: Advanced CMOS: Material Science / Process Engineering / Device Technology :

[A-7]Advanced CMOS: CFET

Wed. Sep 4, 2024 1:30 PM - 2:45 PM JST
Wed. Sep 4, 2024 4:30 AM - 5:45 AM UTC
Room A (407)(4th Floor)
Session Chair: Kuniyuki Kakushima (Tokyo Tech), Anabela Veloso (imec)
02: Advanced and Emerging Memories / New Applications :

[B-1]Ferroelectric Memory Materials

Mon. Sep 2, 2024 2:30 PM - 3:45 PM JST
Mon. Sep 2, 2024 5:30 AM - 6:45 AM UTC
Room B (408)(4th Floor)
Session Chair: Halid Mulaosmanovic (GlobalFoundries), Atsushi Himeno (Panasonic Holdings Corp.)
02: Advanced and Emerging Memories / New Applications :

[B-2]In-Memory and Unconventional Computing I

Mon. Sep 2, 2024 4:15 PM - 5:30 PM JST
Mon. Sep 2, 2024 7:15 AM - 8:30 AM UTC
Room B (408)(4th Floor)
Session Chair: Ming-Hsiu Lee (Macronix International Co., Ltd.), Xu Bai (NanoBridge Semiconductor, Inc.)
02: Advanced and Emerging Memories / New Applications :

[B-3]Ferroelectric Devices

Tue. Sep 3, 2024 9:00 AM - 10:15 AM JST
Tue. Sep 3, 2024 12:00 AM - 1:15 AM UTC
Room B (408)(4th Floor)
Session Chair: Laurent Grenouillet (CEA-Leti), Kouichi Nagai (Fujitsu Semiconductor Memory Solution Ltd.)
02: Advanced and Emerging Memories / New Applications :

[B-4]Ferroelectric Memory Devices

Tue. Sep 3, 2024 10:45 AM - 12:15 PM JST
Tue. Sep 3, 2024 1:45 AM - 3:15 AM UTC
Room B (408)(4th Floor)
Session Chair: Atsushi Himeno (Panasonic Holdings Corp.), Ming-Hsiu Lee (Macronix International Co., Ltd.)
02: Advanced and Emerging Memories / New Applications :

[B-5]In-Memory and Unconventional Computing II

Wed. Sep 4, 2024 9:00 AM - 10:30 AM JST
Wed. Sep 4, 2024 12:00 AM - 1:30 AM UTC
Room B (408)(4th Floor)
Session Chair: Kazuyuki Kouno (Nuvoton Technology Corp. Japan), Halid Mulaosmanovic (GlobalFoundries)
02: Advanced and Emerging Memories / New Applications :

[B-6]3D NAND Flash Memory

Wed. Sep 4, 2024 10:45 AM - 12:15 PM JST
Wed. Sep 4, 2024 1:45 AM - 3:15 AM UTC
Room B (408)(4th Floor)
Session Chair: Ken Takeuchi (The Univ. of Tokyo), Keiji Hosotani (KIOXIA Corp.)
02: Advanced and Emerging Memories / New Applications :

[B-7]ReRAM, PCRAM, and FeRAM

Wed. Sep 4, 2024 1:30 PM - 2:45 PM JST
Wed. Sep 4, 2024 4:30 AM - 5:45 AM UTC
Room B (408)(4th Floor)
Session Chair: Xu Bai (NanoBridge Semiconductor, Inc.), Yoshihiro Sato (Tohoku Univ.)
02: Advanced and Emerging Memories / New Applications :

[B-8]Ferroelectric FET

Wed. Sep 4, 2024 3:15 PM - 4:30 PM JST
Wed. Sep 4, 2024 6:15 AM - 7:30 AM UTC
Room B (408)(4th Floor)
Session Chair: E Ray Hsieh (National Central Univ.), Laurent Grenouillet (CEA-Leti)
03: Heterogeneous and 3D Integration / Interconnect / MEMS :

[C-1]Advanced Metallization I

Mon. Sep 2, 2024 2:30 PM - 3:45 PM JST
Mon. Sep 2, 2024 5:30 AM - 6:45 AM UTC
Room C (409)(4th Floor)
Session Chair: Wei Feng  (AIST), Takashi Matsumoto (Tokyo Electron Technology Solutions Ltd.)
03: Heterogeneous and 3D Integration / Interconnect / MEMS :

[C-2]MEMS and Advanced Metallization I

Mon. Sep 2, 2024 4:15 PM - 4:45 PM JST
Mon. Sep 2, 2024 7:15 AM - 7:45 AM UTC
Room C (409)(4th Floor)
Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Christian Dussarrat (Air Liquide)
03: Heterogeneous and 3D Integration / Interconnect / MEMS :

[C-4]Advanced integration

Tue. Sep 3, 2024 10:45 AM - 12:00 PM JST
Tue. Sep 3, 2024 1:45 AM - 3:00 AM UTC
Room C (409)(4th Floor)
Session Chair: Masayuki Kitamura (KIOXIA Corp.), Yoshiyuki Ohba (Sony Semiconductor Manufacturing Corp.)
03: Heterogeneous and 3D Integration / Interconnect / MEMS :

[C-5]Advanced Metallization II

Wed. Sep 4, 2024 9:00 AM - 10:00 AM JST
Wed. Sep 4, 2024 12:00 AM - 1:00 AM UTC
Room C (409)(4th Floor)
Session Chair: Xun Gu (ASM Japan), Takashi Matsumoto (Tokyo Electron Technology Solutions Ltd.)
03: Heterogeneous and 3D Integration / Interconnect / MEMS :

[C-6]MEMS and Advanced Metallization II

Wed. Sep 4, 2024 10:45 AM - 12:00 PM JST
Wed. Sep 4, 2024 1:45 AM - 3:00 AM UTC
Room C (409)(4th Floor)
Session Chair: Takeo Minari (NIMS), Akinobu Yamaguchi (Toyo Univ.)
04: Power / High‐speed Devices and Materials :

[D-1]Ga2O3 Power Devices

Mon. Sep 2, 2024 2:30 PM - 4:00 PM JST
Mon. Sep 2, 2024 5:30 AM - 7:00 AM UTC
Room D (Medium Hall)(2nd Floor)
Session Chair: Kohei Sasaki (Novel Crystal Technology, Inc.), Masashi Kato (Nagoya Inst. of Technology)
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